A support device and support method for cutting thin slices with a band saw cutting machine

Abstract

The invention relates to the field of band saw cutting and slicing, in particular to a support device and a support method for cutting thin slices by a band saw cutting machine. The support device includes a main body, a cylinder, a clamping device and an action shaft; the rear end of the main body has an opening, and a rear support plate is arranged vertically in the opening, and a plurality of parallel passages are arranged in the main body along the horizontal direction, and each passage is provided with an action Shaft; the front end of the action shaft protrudes from the main body and connects with the rubber suction cup, the rear end is connected with the rear support plate, and the middle part is provided with a clamping device; the front end of the main body is connected with the cylinder, and the telescopic shaft of the cylinder is connected with the rear support plate. The present invention also provides a supporting method using the above device. When the thin slice is cut, the present invention can effectively support the cut thin slice, and at the same time, does not apply force to the thin slice, so as to avoid edge collapse and damage of the thin slice.

Description

technical field [0001] The utility invention relates to the field of cutting and slicing by a band saw, in particular to a support device and a support method for cutting thin slices by a band saw cutting machine. Background technique [0002] When using a band saw to cut thin slices, including solar energy, semiconductor monocrystalline silicon, sapphire and other large-diameter thin slices, it is necessary to support and fix the thin slices. With the conventional support technology, during the cutting process, since the band saw is cut against the sheet workpiece, the high-speed rotation of the band saw will cause the sheet workpiece to vibrate, and the support device will produce a direction to the workpiece (such as the gap between the silicon rod and the sheet) In the cutting process, fragments and large dimensional deviations are prone to occur, resulting in waste of workpieces, defective products in thin slices, and so on. In order to solve this problem, it is necess...

AI Technical Summary

Problems solved by technology

With the conventional support technology, during the cutting process, since the band saw is cut against the sheet workpiece, the high-speed rotation of the band saw will cause the sheet workpiece to vibrate, and the support device will produce a direction to the workpiece (such as the gap between the silicon rod and the sheet) In this way, the vibration of the sheet is aggravated, and fragments and large dimensional deviations are prone to occur during the cutting process, resulting in waste of workpieces, defective products of sheet workpieces, etc.

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