Substrate splitter
A technology for substrates and splits, applied in the field of substrate splitting devices, can solve problems such as particle pollution, and achieve the effect of solving particle pollution and avoiding particles of protective layer materials.
Active Publication Date: 2021-09-03
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
[0005] The invention provides a substrate splitting device to solve the problem of particle pollution in the existing substrate splitting technology
Method used
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[0030] The technical solutions in the embodiments and / or examples of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the embodiments and / or examples described below are only part of the implementation of the present invention. schemes and / or examples, rather than all implementations and / or examples. Based on the implementations and / or examples in the present invention, all other implementations and / or examples obtained by persons of ordinary skill in the art without creative work fall within the protection scope of the present invention.
[0031] The directional terms mentioned in the present invention, such as [top], [bottom], [left], [right], [front], [back], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the pre...
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The invention provides a substrate splitting device, comprising: a splitting machine, used to carry a substrate; a first coating member, used to coat a first protective layer on the polished area of the substrate; a second coating member, used to coat the substrate on the polished area A second protective layer is coated on the top, and in the grinding area, the second protective layer covers the first protective layer; a split member is used to split the substrate; a first removal member is used to remove the first protective layer and the grinding area. The second protective layer; the grinding member, used for grinding the polished area of the substrate; the second removing member, used for removing the second protective layer. By coating the first protective layer on the polished area of the substrate before applying the second protective layer, the first protective layer in the polished area of the substrate is removed while the second protective layer is removed, so that the protective layer material in the grinding process is avoided. Particles are generated, thereby solving the problem of particle pollution in the existing substrate split technology.
Description
technical field [0001] The invention relates to the field of display manufacturing process, in particular to a substrate splitting device. Background technique [0002] In the manufacturing process of the display, due to the limitation of size, after the array process is completed, a layer of photoresist needs to be coated on the upper surface of the substrate to protect the substrate, and then the substrate is cut and split to reduce the size of the substrate. Carry out follow-up process. [0003] However, after the splitting of the photoresist coated on the entire surface is completed, the photoresist at the split position is polished, which will generate more photoresist particles, which will enter the subsequent equipment and process, thereby polluting the subsequent process. [0004] Therefore, the existing substrate fragmentation technology has the problem of particle contamination, which needs to be improved. Contents of the invention [0005] The invention provid...
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IPC IPC(8): G09F9/00
CPCG09F9/00
Inventor 郝鹏
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD