Loading port and efem

Abstract

The invention provides a loading port and an EFEM, which can shorten the time required by the door cleaning process and prevent the undesired gas causing the performance change of the object to be conveyed, namely the wafer, from flowing into the conveying chamber. the first sealing part (5) is arranged between the FOUP4 and the base (21) at a preset position in front of the base (21) in a sealingmode, and the second sealing part (6) is arranged between the loading port door (22) and the base (21) in a closed state of closing the opening part (21a) in a sealing mode. In a door cleaning process in which a gap between a container door and a loading port door (22) and a sealed space (DS) partitioned by a first sealing part (5) and a second sealing part (6) are replaced with gas, a preferentially open part (X) of the first sealing part (5) is preferentially open than the second sealing part (6) by keeping the sealed space (DS) at a positive pressure. At least the gas in the enclosed space(DS) can be discharged through the open part.

Description

technical field [0001] The present invention relates to a loadport functioning as an interface for delivering a conveyance object contained in a container to a conveyance space, and an EFEM provided with the loadport. Background technique [0002] For example, in a semiconductor manufacturing process, wafers are processed in a clean room in order to improve yield and quality. In recent years, the "mini-surrounding method" in which the cleanliness is further improved only in a local space around the wafer has been adopted, and measures for carrying and other processing of the wafer have been adopted. In the small enclosure method, a load port (Load Port) is provided adjacent to the transfer chamber inside the box, and the load port constitutes a part of the wall surface of the substantially closed wafer transfer chamber (hereinafter referred to as the transfer chamber), and places The high-clean internal space accommodates a transport container (hereinafter referred to as "c...

AI Technical Summary

Problems solved by technology

[0007] However, if it is the above-mentioned structure in which the sealing member is installed, air and particles remain in the closed space, and the load port door and the FOUP door are opposed to each other through a predetermined gap, and these FOUP doors and the load port door are simultaneously When opening, the air and particles remaining in the closed space may be mixed into the FOUP and the transfer chamber, which may cause changes in the performance of the wafer in EFEM that requires low oxygen concentration and low humidity.

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