The invention relates to a bonding 
copper wire and a preparation method thereof. The bonding 
copper wire comprises the following components in percentage by 
mass: 0.0003 percent to 0.003 percent of 
lithium, 0.0002 percent to 0.002 percent of 
calcium, 0.0002 percent to 0.001 percent of 
aluminium, 0.0005 percent to 0.005 percent of 
cerium and / or 
yttrium, 0.0001 percent to 0.001 percent of other inevitable 
impurity elements and the balance of 
copper. The preparation method of the bonding 
copper wire comprises the following steps of: preparing a middle 
alloy, preparing an 
alloy cast 
ingot, annealing uniformly, heat 
extrusion, 
stress relief annealing, drawing, final annealing, winding for multiple coils, packaging, and final protective packaging, wherein in a drawing process, middle 
stress relief annealing can be performed according to practical needs. The bonding 
copper wire has better inoxidizability while keeping better conduction and 
radiation properties; in the preparation process of the bonding 
copper wire, the uniform annealing is added and the middle 
stress relief annealing is performed, so that the 
mechanical property of the prepared bonding copper wire is better.