Sound production device

A sounding device and installation slot technology, applied in the direction of sensors, electrical components, loudspeakers, etc., can solve the problems of inability to demould, poor reliability of side magnetic guide plate and shell, and inability to adopt integral molding, so as to avoid mutual interference, Ensure connection reliability and good waterproof effect
CN110366079AActive Publication Date: 2019-10-22GOERTEK INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GOERTEK INC
Publication Date
2019-10-22

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Abstract

The invention discloses a sound production device, and the sound production device comprises: a housing which is provided with two through ends, and comprises a first housing and a second housing which are distributed in the through direction of the housing and cooperate with each other; a vibrating diaphragm, wherein the vibrating diaphragm and the first shell are integrally formed; and a side concentrating flux plate, wherein the side concentrating flux plate and the second shell are integrally formed. According to the technical scheme, the reliability of connection between the side concentrating flux plate and the shell can be improved.
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Description

technical field

[0001] The invention relates to the technical field of sound energy conversion, in particular to a sound generating device. Background technique

[0002] For the sound-generating device, the integral molding of the diaphragm and the casing can avoid gaps between the diaphragm and the casing, so that the waterproof function can be better realized. However, when the diaphragm and the shell are integrally formed, if the side magnetic plate and the shell are also integrally formed, due to the limitation of the mold structure, the diaphragm and the side magnetic plate interfere with each other, resulting in the inability to demould, so the use of There is no way to integrally form the diaphragm and the side magnetic plate with the casing at the same time. The current general method is to bond the side magnetically conductive plate to the casing, which leads to poor reliability between the side magnetically conductive plate and the casing. Contents of the invent...

Claims

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