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LED adhesive sealing method and device

A sealing device, LED chip technology, applied to the surface coating liquid device, electrical components, circuits, etc., can solve the problems of low sealing efficiency, easy to generate air bubbles, poor sealing consistency, etc., to achieve simplified sealing device, improve efficiency, and save sealing time

Active Publication Date: 2019-10-25
ZHEJIANG INTELED OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the fact that air bubbles are easily generated in the LED sealing operation of the prior art, and it is difficult to control the consistency of the amount of glue in each bowl, resulting in uneven glue surface, which affects the performance and consistency of the LED chip; and the traditional sealing In the glue operation, one needle can only point one bowl at a time, which leads to the problems of low sealing efficiency and poor sealing consistency. A LED sealing method and device are provided, which can not only improve the sealing efficiency, but also ensure the sealing process. There will be no air bubbles in the container, after the sealing is completed, the amount of glue in each bowl is the same, and the glue surface is smooth

Method used

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  • LED adhesive sealing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Place the lower mold above the transmission device on the tray, place the bracket with the LED chip in the cup on the lower mold, and then place the upper mold on the bracket to complete the assembly of the sealing mold; place the LED sealing device on the In the confined space, use a vacuum pump to evacuate the confined space, and turn on the constant temperature heating device under the tray; when the vacuum degree in the confined space is 99.2Pa and the temperature on the tray is 50°C, turn on the sealing machine to make the sealing machine Lower the rubber cylinder, apply glue on the left side of the upper mold along the width direction of the upper mold; rise the rubber cylinder, lower the push knife, make the push knife contact with the surface of the upper mold on the left side of the glue, move the push knife, and apply the glue from the upper mold Push the left side of the mold to the right side; after removing the upper mold, the lower mold and bracket are sent...

Embodiment 2

[0047] Place the lower mold above the transmission device on the tray, place the bracket with the LED chip in the cup on the lower mold, and then place the upper mold on the bracket to complete the assembly of the sealing mold; place the LED sealing device on the In the confined space, use a vacuum pump to evacuate the confined space, and turn on the constant temperature heating device on the push knife; when the vacuum degree in the confined space is 98.0Pa and the temperature of the push knife is 70°C, turn on the sealing machine to make the sealant The rubber cylinder on the machine is lowered, and the glue is applied to the left side of the upper mold along the width direction of the upper mold; the rubber cylinder is raised, and the push knife is lowered, so that the push knife is in contact with the surface of the upper mold on the left side of the glue, and the push knife is moved to apply the glue from the upper mold. Push the upper mold from the left to the right; afte...

Embodiment 3

[0049] Place the lower mold above the transmission device on the tray, place the bracket with the LED chip in the cup on the lower mold, and then place the upper mold on the bracket to complete the assembly of the sealing mold; place the LED sealing device on the In the confined space, use a vacuum pump to evacuate the confined space; when the vacuum degree in the confined space is 99.7Pa, open the sealing machine, lower the rubber cylinder on the sealing machine, and apply glue on the upper mold along the width direction of the upper mold. Left side; the rubber cylinder rises, and the push knife is lowered so that the push knife is in contact with the surface of the upper mold on the left side of the glue, and the push knife is moved to push the glue from the left side of the upper mold to the right; after the upper mold is removed, it passes through the conveying device Send the lower mold and bracket into the baking device, and bake at 130°C for 30 minutes to complete the se...

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Abstract

The invention relates to the field of LED production, and discloses a LED adhesive sealing method and device. The device comprises a carrying plate, an adhesive sealing mold and an adhesive sealing machine, wherein the adhesive sealing mold comprises a lower mold, a support and an upper mold; and bowl cups are arranged on the support, an adhesive entering through hole is formed in the position, corresponding to each bowl cup, of the upper mold, and an adhesive cylinder and a push broach are arranged on the adhesive sealing machine. The adhesive sealing method comprises the following steps of assembling the adhesive sealing mold; placing the adhesive sealing device in a confined space and vacuumizing; starting the adhesive sealing machine so as to enable the adhesive cylinder applies adhesive on one side of the upper mold in the width direction of the upper mold; pushing the adhesive from one side of the upper mold to the other side of the upper mold by using the push broach; and afterremoving the upper mold, feeding the lower mold and the support into a baking device to be baked to complete the adhesive sealing. According to the LED adhesive sealing method, the adhesive sealing operation is carried out under a vacuum condition, so that bubbles cannot generate after adhesive sealing; the push broach is used for pushing the adhesive into the bowl cups on the support, it is guaranteed that the adhesive surface in each bowl cup is flush with the bottom surface of the push broach, so that the consistency of the adhesive amount in each bowl cup is effectively controlled; and allthe bowl cups can be fully filled with the adhesive through one-time movement of the push broach, so that the adhesive sealing efficiency is improved.

Description

technical field [0001] The invention relates to the field of LED production, in particular to an LED sealing method and device. Background technique [0002] The purpose of sealing LED is to mechanically protect the chip, release stress, and serve as a light guide structure, which is a commonly used technical operation in the field of LED production. In the prior art, when LED is sealed with glue, the LED chip is fixed in the bracket bowl, and then the potting glue is dispensed in the bracket bowl through the dispensing head on the glue dispenser, so as to realize the physical protection of the LED chip. [0003] For example, the "Sealing method in the process of LED lamp packaging" disclosed in the Chinese patent literature, its announcement number CN104409611A, firstly, a distance measuring sensor connected to the controller is installed on the sealing machine; secondly, the LED The depth of the light cup and the caliber of the bowl; then, adjust the speed of the roller o...

Claims

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Application Information

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IPC IPC(8): B05C9/14B05C5/00B05C5/02B05C11/04B05C13/02B05C15/00H01L33/52
CPCB05C5/001B05C5/0208B05C9/14B05C11/04B05C13/02B05C15/00H01L33/52
Inventor 欧锋
Owner ZHEJIANG INTELED OPTOELECTRONICS TECH