A power semiconductor module packaging structure

Abstract

The invention discloses a packaging structure of a power semiconductor module, which is characterized in that it comprises a substrate; a casing, the bottom of the casing is fastened to the top of the substrate; a power semiconductor module subunit is arranged on the casing In the accommodation space formed by the body and the substrate, it is used to form a topology control circuit structure. The power semiconductor module subunit includes a plurality of backing boards arranged at intervals on the base board, and between two of the backing boards arranged oppositely The power terminal set is connected with the module-level bonding wire, and the top of the power terminal set extends out of the top of the casing. The invention can double the current density, has high yield and good reliability.

Description

technical field [0001] The invention relates to a packaging structure of a power semiconductor module, which belongs to the field of semiconductor devices. Background technique [0002] In order to meet the needs of users in terms of power, the power semiconductor module usually adopts the method of connecting more power chips in parallel to increase the current level of the power semiconductor module to increase the overall output power of the module. With the increase in the number of power chips connected in parallel, power semiconductor modules will face various challenges in the production process and application process. Connection technology is used to realize the parallel connection of chips, thereby increasing the complexity of the module production process and resulting in a decrease in product yield. When the power semiconductor module is in the working state, the complexity of the electromagnetic characteristics, thermal characteristics, and mechanical character...

AI Technical Summary

Problems solved by technology

With the increase in the number of power chips connected in parallel, power semiconductor modules will face various challenges in the production process and application process. Connection technology is used to realize parallel connection of chips, thereby increasing the complexity of the module production process and resulting in a decrease in product yield

When the power semiconductor module is in the working state, due to the complexity of the electromagnetic characteristics, thermal characteristics, and mechanical characteristics among multiple parallel chips inside it increases with the increase in the number of parallel chips, the reliability of the power semiconductor module is reduced.

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