Elastic sub-module and modular crimping type semiconductor module
An elastic and crimp-type technology, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of independent chip conductive path, limited chip current sharing effect, and difficult installation, so as to improve power The effect of density and current level, reduction of processing procedures, and reduction of material costs
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[0030] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.
[0031] Such as figure 1 As shown, an elastic sub-module includes: a conductive sheet 1, an insulating elastic member 2 and a conductive plate 3;
[0032] The conductive sheet 1 is bent into a bent conductive sheet with several grooves 4, the conductive sheet 1 is clamped on the upper end of the insulating elastic member 2 through its grooves, and the lower end of the insulating elastic member 2 is connected to the conductive plate 3;
[0033] When no pressure is applied to the elastic sub-module, the insulating elastic member 2 supports the conductive sheet 1, and there is a gap between the conductive sheet 1 and the conductive plate 3. The conductive sheet 1 and the conductive plate 3 are not ...
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