Method for welding components on circuit board

Abstract

The invention discloses a method for welding components on a circuit board, and relates to the circuit board production process. The method is used for solving the problems of narrow wave soldering application range and low production efficiency. The method comprises the following steps of brushing tin, namely brushing solder paste on patches and plug-in parts on the circuit board; SMD componentsor inserting components, namely installing SMD components or inserting components onto the circuit board; placing a die and positioning, bearing the circuit board with the components by using a welding jig so as to keep the circuit board in a horizontal state; carrying out heating welding, and carrying out reflow soldering on the welding jig provided with the circuit board; detecting and packaging: inspecting the welded circuit board, and packaging and storing the circuit board after ensuring that welding spots are in sufficient contact and are full. Compared with the prior art, by adopting the method, SMD components and inserting components can be mounted on the circuit board at the same time and welded synchronously. A large number of processing steps can be reduced compared with a wavesoldering mode. The manual participation degree is reduced. Therefore, the production efficiency of the circuit board can be greatly improved.

Description

technical field [0001] The invention relates to a circuit board production process, in particular to a method for welding components on a circuit board. Background technique [0002] The circuit board is the carrier of electronic components and the connection provider between electronic components. In all fields involving electronic circuits, basically all need to be applied to circuit boards. According to different types, circuit boards can be divided into covering Copper plate, aluminum substrate, ceramic circuit board, etc. [0003] At present, the Chinese invention patent with the authorized notification number CN106413282B discloses a partial wave soldering process for electronic circuit boards, which includes the following steps, providing an electronic circuit board to be soldered whose soldering surface is divided into a surface mount device area and a plug-in area; The soldered electronic circuit board is sent into the device coated with flux, and the spraying rang...

AI Technical Summary

Problems solved by technology

[0005] The form of wave soldering is limited to tinning the lower surface of the circuit board. During the process of tinning, if the tin liquid directly contacts the SMD components, the high temperature will re-melt the joints between the SMD components and the circuit board. Soldering will cause damage to the circuit board, so the wave soldering method can only solder the plug-in, and can only solder the circuit board where the patch component and the plug-in component are on the same side, so the application of wave soldering is extremely limited. If you want to complete the processing of this kind of circuit board, you must manually carry out the welding operation, and the manual welding operation is cumbersome and the production efficiency is low.

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