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Apparatus and Method for treating substrate

A substrate and processing space technology, which is applied in chemical instruments and methods, cleaning methods and utensils, and cleaning methods using gas flow, etc., can solve the problems of reduced airtightness and damage of processing spaces.

Pending Publication Date: 2019-11-05
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the first body 2 and the second body 4 are damaged, and the airtightness of the processing space is lowered

Method used

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  • Apparatus and Method for treating substrate
  • Apparatus and Method for treating substrate
  • Apparatus and Method for treating substrate

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Embodiment Construction

[0034] However, inventive concepts may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the inventive concept will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Therefore, in the drawings, the size of components is exaggerated for clarity of illustration.

[0035] In the following, reference will be made to Figure 2 to Figure 17 Embodiments of the inventive concept are described in detail.

[0036] figure 2 is a plan view illustrating a substrate processing apparatus 1 according to an embodiment of the present inventive concept.

[0037] refer to figure 2 , the substrate processing apparatus 1 has an index module 10 and a processing module 20 . The index module 10 has a load port 120 and a transfer frame 140 . The load port 120, the transfer frame 140, and the processing module 20 are sequentially ar...

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PUM

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Abstract

The present invention relates to an apparatus and a method for treating a substrate in a high-pressure atmosphere. The apparatus includes a chamber having a first body and a second body that are combined with each other to form a processing space inside, an actuator that moves a relative position between the first body and the second body to enable a position change between a closed position in which the processing space is sealed from the outside and an open position in which the processing space is open to the outside, the actuator to sequentially perform a high-speed closing step of movingthe first body or the second body at a first speed and a low-speed closing step of moving the first body or the second body at a second speed lower than the first speed, at the time of the position change from the open position to the closed position.

Description

technical field [0001] Embodiments of the inventive concepts described herein relate to substrate processing apparatuses and methods, and more particularly, to apparatus and methods for processing substrates in a high pressure atmosphere. Background technique [0002] In order to manufacture a semiconductor device, a desired pattern is formed on a substrate through various processes such as photolithography, etching, ashing, ion implantation, thin film deposition, and the like. Various treatment fluids are used in these processes, and pollutants and particles are generated during these processes. Cleaning procedures for removing contaminants and particles from the substrate must be performed before and after each procedure. [0003] During the cleaning process, the substrate is typically treated with chemicals and rinses and then dried. The drying process is a process for drying the rinse liquid remaining on the substrate. In the drying process, the rinse solution on the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67034H01L21/67051H01L21/6719H01L21/67126H01L21/67028H01L21/6715H01L21/02043H01L21/02057H01L21/02101H01L21/68764B08B5/02
Inventor 李相旼朴舟楫金鹏李钟斗
Owner SEMES CO LTD