Active medical device reliability test method based on combined stress

Abstract

The invention discloses an active medical device reliability test method based on a combined stress. The method comprises the steps of: rigidly connecting a tested prototype onto a vibration table board in a test box by a frock clamp; making a stress application section model for the tested prototype, wherein the stress application section model comprises a sample actual measurement test stage anda simulated measurement test stage; according to the stress application section model, carrying out superimposed application of a high and low temperature change stress, a hygrothermal stress and a pull-off electric stress on the tested prototype; in the testing process, carrying out functional performance test on the tested prototype at a preset test point, and recording test data; and carryingout statistics on a fault number of the tested prototype according to the test data and determining fault categories of the tested prototype. By the active medical device reliability test method disclosed by the invention, reliability of an active medical device product can be comprehensively verified, product defect exposure efficiency is improved by actively exciting defects of the product, theresearch and development period of the high-quality active medical device product is effectively shortened, and research and development cost is reduced.

Description

technical field [0001] The invention relates to the field of reliability testing of active medical devices, in particular to a reliability testing method for active medical devices based on comprehensive stress. Background technique [0002] At present, electronic products such as active medical devices need to be tested for their reliability before they are put into use to ensure that the electronic products can be used normally. The comprehensive stress intensification test is a research test to improve product reliability design and reliability analysis. By increasing the environmental stress (high temperature, low temperature, shock, vibration, damp heat) and electrical stress of the product test, the purpose of exposing the weak point of product function and performance in a short time is achieved, and then technical improvement measures are formulated to improve product reliability. Product reliability growth is of great significance. However, conventional reliability...

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Problems solved by technology

However, conventional reliability tests usually use passive environmental simulation plus design margins to ensure that the product passes the qualification test and verification test. The environmental stress test is an asynchronous short-term performance test, which is not enough to fully verify the reliability of the product. , and the existing reliability test will not actively stimulate product defects, which greatly prolongs the development cycle of high-quality products and increases the development cost

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