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OLED device package structure, manufacturing method thereof and display device

A light-emitting diode and device packaging technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as cracks, reduced service life of OLED devices, damage to OLED devices, etc., to increase stress buffering, Improvement of service life, effect of service life improvement

Inactive Publication Date: 2019-11-08
CHONGQING HKC OPTOELECTRONICS TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing flexible OLED display devices include an OLED device and an encapsulation structure arranged on the surface of the OLED device. The encapsulation structure is generally an alternate deposition of organic material film layers and inorganic material film layers. If the stress between the layers is different and there is no interaction force between the layers, gaps tend to appear between the layers of the packaging structure during the curling or folding process, allowing water vapor and oxygen to enter the OLED device, causing permanent damage to the OLED device, that is Reduced lifetime of OLED devices

Method used

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  • OLED device package structure, manufacturing method thereof and display device
  • OLED device package structure, manufacturing method thereof and display device
  • OLED device package structure, manufacturing method thereof and display device

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0032] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions among the components in a specific posture. If the specific posture changes, the directional indications will also be corresponding change accordingly.

[0033] In addition, in the present invention, descriptions such as "first", "second" and so on are used for desc...

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Abstract

The invention discloses an OLED device package structure, a manufacturing method thereof and a display device. The OLED device package structure includes a first inorganic layer, a package unit layerand a second inorganic layer which are successively stacked, wherein the first inorganic layer is disposed on the surface of an OLED device. The package unit layer comprises a plurality of organic pillars arranged at intervals on the surface of the first inorganic layer away from the OLED device; a third inorganic layer arranged in gaps between every two adjacent organic pillars and covering eachof the organic pillars; and an organic flat layer disposed between the third inorganic layer and the second inorganic layer. The service life of the OLED device can be prolonged.

Description

technical field [0001] The invention relates to the technical field of display devices, in particular to an organic light emitting diode device packaging structure, a manufacturing method thereof, and a display device. Background technique [0002] Flexible organic light-emitting diode (Organic Light-Emitting Diode, OLED) display device has become the most potential new display device in recent years because of its advantages such as low power consumption, high color saturation, wide viewing angle, light and thin, low cost and flexible performance. . [0003] Existing flexible OLED display devices include an OLED device and an encapsulation structure arranged on the surface of the OLED device. The encapsulation structure is generally an alternate deposition of organic material film layers and inorganic material film layers. If the stress between the layers is different and there is no interaction force between the layers, gaps tend to appear between the layers of the packag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/50H01L51/52H01L51/56
CPCH10K50/00H10K50/846H10K50/84H10K71/00
Inventor 孙晓午
Owner CHONGQING HKC OPTOELECTRONICS TECH CO LTD
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