Package cover plate, display device, display panel, and packaging method of display panel
A technology for encapsulating cover plates and display substrates, which is applied in the manufacture of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as poor display of display panels
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Embodiment 1
[0032] refer to figure 1 , which shows a schematic structural view of a packaging cover plate described in Embodiment 1 of the present application, specifically including:
[0033] A base substrate 1, the base substrate 1 includes a display area and a packaging area arranged around the display area.
[0034] In the direction from the display area to the encapsulation area, an encapsulation layer 2 , a first barrier layer 3 , a water absorbing layer 4 and a second barrier layer 5 are sequentially arranged in the encapsulation area of the base substrate.
[0035] Specifically, the encapsulation layer 2 may be formed in the encapsulation area of the base substrate in a direction from the display area to the encapsulation area by using a gluing machine. Then, the first barrier layer 3, the water-absorbing layer 4 and the second barrier layer 5 are formed by using a glue coating machine.
[0036] Wherein, the material of the base substrate can be a glass substrate, a plastic ...
Embodiment 2
[0050] The present application also discloses a display panel, including a display substrate 6 arranged on the box and the packaging cover in Embodiment 1, such as figure 2 shown.
[0051] The display panel has all the advantages of the encapsulation cover plate in the first embodiment above, which will not be repeated here.
Embodiment 3
[0053] The present application also discloses a display device, including the display substrate in the second embodiment.
[0054] The display device has all the advantages of the display substrate in the second embodiment above, and will not be repeated here.
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Abstract
Description
Claims
Application Information
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