Heat dissipation device

Abstract

The invention provides a heat dissipation device including a base having a first chamber, wherein the first chamber has a plurality of partitions separating the first chamber to form a plurality of compartments, the plurality of compartments are not connected to each other and are provided with first working fluids, the upper side of the base is provided with a plurality of two-phase flow heat dissipation fins, second chambers are respectively formed inside the plurality of two-phase flow heat dissipation fins, and the plurality of compartments and the plurality of second chambers are selectedto be in communication with each other or not connected to each other, thereby achieving a good heat dissipation effect.

Description

Technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device which is provided with a heat dissipation chamber inside a heat dissipation fin and a base for the circulation of working fluid, so as to effectively achieve a good heat dissipation effect. Background technique [0002] Current mobile equipment, personal computers, servers, communication cases, base stations, or other systems or devices, with the advancement of science and technology, their computing functions and efficiency are gradually becoming stronger, and their internal heating elements (such as but not limited to chips and various power components) ) High heat is generated during operation, so the heat of the heating element must be dissipated first. In order to prevent the heating element from overheating and causing the heating element to fail, a heat sink is usually installed on the heating element to increase the service life of the heating element. [00...

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Problems solved by technology

[0003] The current heat dissipation device is to install solid heat dissipation fins on the upper side of the temperature chamber, and to enlarge the heat dissipation area by means of the solid heat dissipation fins to increase the heat dissipation effect, or to further install a fan to generate a large air flow for heat dissipation. However, the current mobile devices, personal computers , servers, communication chassis, base stations, or other systems or devices have a narrow internal space that is not suitable for installing fans, and the solid cooling fins will be affected by the thermal conductivity of the material itself, which will affect the cooling effect. The heat dissipation device of the fin no longer meets the technical requirements of the future industry

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