Display device, display panel and manufacturing method thereof

A display panel and display area technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems that the packaging effect of OLED display panels needs to be improved, so as to reduce voltage drop, improve packaging effect, reduce The effect of impedance

Inactive Publication Date: 2019-11-15
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
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  • Abstract
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  • Claims
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Problems solved by technology

However, the encapsulation effect of existing

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  • Display device, display panel and manufacturing method thereof
  • Display device, display panel and manufacturing method thereof
  • Display device, display panel and manufacturing method thereof

Examples

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Embodiment Construction

[0044] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0045] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanyin...

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Abstract

The invention relates to a display device, a display panel and a manufacturing method of the display panel, and relates to the technical field of display. The display panel includes an array substrate, a package layer, a package substrate, an auxiliary electrode and a conductive connection structure. The array substrate includes a pixel defining layer and a transparent cathode layer arranged on one side of the pixel defining layer, and the pixel defining layer defines a plurality of pixel areas. The package layer covers the cathode layer, and the package layer is provided with a through hole exposing the cathode layer. The projection of the through hole on the array substrate is located in the pixel defining layer. The package substrate and the array substrate are arranged oppositely. Theauxiliary electrode is arranged on the surface, close to the array substrate, of the package substrate, and the projection of the auxiliary electrode on the array substrate is located in the pixel defining layer. The conductive connection structure covers the auxiliary electrode, and passes through the through hole to be electrically connected with the cathode layer. The package effect of the display panel in the disclosure can be improved.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular, to a display device, a display panel, and a method for manufacturing the display panel. Background technique [0002] Currently, an OLED (Organic Light Emitting Diode, organic electroluminescent diode) display panel has been widely used due to its advantages of wide color gamut and wide viewing angle. Existing OLED display panels include two types of top emission and bottom emission, among which top emission OLED display panels are widely used. Existing OLED display panels generally include an array substrate with multiple light emitting devices, and in order to protect the light emitting devices, the array substrate needs to be packaged. However, the encapsulation effect of the existing OLED display panel still needs to be improved. [0003] It should be noted that the information disclosed in the above background section is only for enhancing the understanding of ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/56
CPCH10K59/00H10K59/122H10K59/12H10K71/00
Inventor 苏同上王东方刘军汪军王庆贺闫梁臣
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
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