Pipe electroplating device

A technology for electroplating equipment and pipes, applied in the electrolytic process, electrolytic components, etc., can solve the problems of unqualified copper pipe size, pipe burst, poor fluidity of electroplating liquid, etc.

Pending Publication Date: 2019-11-19

FOSHAN SHUNDE DISTRICT JIEYONG ELECTRIC IND

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AI-Extracted Technical Summary

Problems solved by technology

[0003] 1. Due to the soft material of pure copper, the copper tube is easily deformed when it is pressed by external force, resulting in unqualified size of the copper tube and affecting the installation;

[0004] 2. Copper powder will be produced during the chamfering process of the copper tube. The copper powder adheres to the inner wall of the copper tube and is difficult to clean. The residual copper powder will affect the operation of the compressor;

[0005] 3. When the air conditioner is running, the copper pipe needs to bear a certain pressure, and the copper pipe has limited pressure resistance, so there is a certain risk of pipe explosion during operation

The...

Method used

Further, the diameter of described liquid outlet hole 7 increases gradually from the head end of infusion tube 4 to the end of infusion tube 4; The end of the tube 4 tapers off. The arrangement of the liquid outlet hole 7 balances the amount of chemical liquid added to the inner wall of the tube body 2 at each height position of the infusion tube 4 to ensure uniform distribution of copper ions in the inner wall electroplating section 3 .

[0040] The electroplating tank 1, the return pipe 8, the chemical liqui...

Abstract

The invention provides a pipe electroplating device. The pipe electroplating device comprises an electroplating tank and a pipe body, wherein the inner part of the electroplating tank is filled with chemical liquid; the pipe body is arranged in the electroplating tank and is placed in the chemical liquid; the inner part of the pipe body forms an inner wall electroplating interval; the pipe electroplating device also comprises a feeding device for conveying the chemical liquid in the inner wall electroplating interval; the feeding device comprises an infusion pipe, a power pump and a chemical liquid tank, which are communicated with one another; the inner part of the chemical liquid tank is filled with the chemical liquid; the infusion pipe extends into the pipe body; a plurality of liquidoutlets are formed in the side of the infusion pipe; and the liquid outlets are distributed at intervals in the length direction of the infusion pipe.

Application Domain

Electrolysis components

Technology Topic

ElectroplatingLiquid tank +1

Image

Examples

Experimental program(1)

Example Embodiment

[0032] The present invention will be further described below with reference to the drawings and embodiments.

[0033] See Figure 1-Figure 4 , The tube electroplating equipment includes an electroplating tank 1 with a chemical solution (ie electroplating solution) inside and a tube body 2 arranged in the electroplating tank 1 and placed in the chemical solution. The inner wall of the tube body 2 constitutes an inner wall electroplating section 3. The outer wall electroplating section 21 is formed between the outer side surface of the body 2 and the inner wall of the electroplating tank 1, and also includes a feeding device for transporting chemical liquid to the inner wall electroplating section 3;

[0034] During the electroplating process of the tube electroplating equipment, the feeding device continuously transports the chemical liquid into the tube body 2 to supplement the copper ions consumed in the inner wall electroplating zone 3 during the electroplating process, and at the same time promotes the flow of the chemical liquid in the tube body 2 to ensure the tube body 2 The electroplating effect of the inner wall.

[0035] Further, the tube body 2 is vertically arranged along its length direction.

[0036] The feeding device includes an infusion tube 4, a power pump 5, and a chemical liquid pool 6 with a chemical liquid inside which are connected in sequence. The infusion tube 4 extends into the tube body 2, and the side of the infusion tube 4 is provided with a plurality of liquid outlet holes 7, and The liquid outlet holes 7 are arranged at intervals along the length direction of the infusion tube 4. The liquid outlet hole 7 penetrates the side of the infusion tube 4.

[0037] When the power pump 5 is running, the chemical liquid in the chemical liquid pool 6 is pumped into the infusion tube 4, and the chemical liquid is supplemented to the different height positions of the inner wall electroplating zone 3 through the liquid outlet 7 on the side of the infusion tube 4 to realize copper ions. The quick replenishment ensures the electroplating effect of the inner wall of the tube body 2.

[0038] The top end of the infusion tube 4 is flush with the top end of the tube body 2, or the top end of the infusion tube 4 is lower than the top end of the tube body 2.

[0039] Further, the electroplating tank 1 is in communication with the chemical bath 6 through a return pipe 8.

[0040] The electroplating tank 1, the return pipe 8, the chemical liquid pool 6, the power pump 5, and the infusion pipe 4 are connected in turn to form a chemical liquid circulation system to promote the circulating flow of the chemical liquid.

[0041] Further, it includes an overflow tank 9. The electroplating tank 1 extends from the bottom of the overflow tank 9 into the overflow tank 9, and the top of the electroplating tank 1 communicates with the interior of the overflow tank 9, and the overflow tank 9 is provided with an overflow Hole 10, one end of the return pipe 8 is communicated with the overflow hole 10.

[0042] The overflow hole 10 is arranged at the lower part or bottom of the side of the overflow tank 9.

[0043] The tube electroplating equipment also includes a bracket 25 and a fixing seat 26. The electroplating tank 1 is set in the bracket 25, the overflow tank 9 is set on the top of the bracket 25, the chemical bath 6 is located outside the bracket 25, and the electroplating tank 1 is set on the fixing seat. 26 on.

[0044] The fixing base 26 is located at the bottom of the bracket 25, and the power pump 5 is located at the side of the fixing base 26.

[0045] Since the tube body 2 is vertically arranged along its length direction, and the infusion tube 4 extends into the tube body 2, the infusion tube 4 is also vertically arranged along its own length direction.

[0046] The power pump 5 pumps the chemical liquid into the infusion tube 4, and the closer the inside of the infusion tube 4 is to the head of the infusion tube 4, the greater the delivery rate of the chemical liquid.

[0047] Further, the diameter of the outlet hole 7 gradually increases from the head end of the infusion tube 4 to the end of the infusion tube 4; the distance between the adjacent outlet holes 7 is from the head end of the infusion tube 4 to the end of the infusion tube 4 The end gradually decreases. This arrangement of the liquid outlet hole 7 balances the amount of chemical liquid added to the inner wall of the tube body 2 at each height position of the infusion tube 4, and ensures the uniform distribution of copper ions in the inner wall electroplating zone 3.

[0048] Further, the bottom of the electroplating tank 1 is provided with a mounting plate 11, the mounting plate 11 is provided with a through hole 12, the through hole 12 is located at the center of the mounting plate 11, the tube body 2 is set on the through hole 12, and the bottom of the infusion tube 4 In communication with the through hole 12, a pipe 13 connecting the through hole 12 and the power pump 5 is provided at the bottom of the mounting plate 11.

[0049] Furthermore, an anode positioning groove 22 located outside the through hole 12 is provided on the mounting plate 11, and a copper rod 14 is inserted into the anode positioning groove 22. The number of anode positioning grooves 22 is several and they are arranged at intervals along the circumferential direction.

[0050] During the electroplating process, the copper rod 14 electrolyzes copper ions and replenishes them into the chemical solution. With the chemical solution circulation system and feeding device, the chemical solution in the inner wall electroplating zone 3 and the outer wall electroplating zone is evenly circulated to ensure that copper ions are evenly electroplated in the tube The outer and inner walls of the body 2.

[0051] Further, the mounting plate 11 is provided with a cathode lower positioning seat 15 located on the through hole 12;

[0052] The bottom end of the tube body 2 is placed on the lower cathode positioning seat 15 to realize the positioning of the bottom end of the tube body 2. The infusion tube 4 passes downward through the cathode lower positioning seat 15 and extends into the through hole 12.

[0053] The installation disk 11 is provided with an anode wire 23 and a cathode wire 24, and both the anode wire 23 and the cathode wire 24 are installed in the installation disk 11 in a pre-buried manner. The mounting plate 11 is made of insulating material to avoid mutual influence between the anode wire 23 and the cathode wire 24.

[0054] One end of the anode wire 23 extends to the bottom of the anode positioning groove 22 and is connected to the copper rod 14. The other end of the anode wire 23 passes through the side of the mounting plate 11 and passes through the side of the electroplating tank 1 and is connected to an external power source.

[0055] One end of the cathode wire 24 extends to the upper surface of the mounting plate 11 and is connected to the bottom of the cathode lower positioning seat 15, and the other end of the cathode wire 24 passes through the side of the mounting plate 11 and exits from the side of the electroplating tank 1 and is connected to an external power source .

[0056] The infusion tube 4 is an auxiliary anode, and the infusion tube 4 is made of insoluble material.

[0057] Further, the upper part of the inner side of the electroplating tank 1 is provided with a positioning plate 16, the side of the positioning plate 16 is in abutting contact with the inner wall of the electroplating tank 1, and the positioning plate 16 is provided with a perforation 20 for the passage of the chemical liquid;

[0058] An upper positioning seat 17 is provided at the bottom of the positioning plate 16, and the top end of the tube body 2 is in abutting contact with the upper positioning seat 17 to realize the positioning of the top end of the tube body 2.

[0059] Further, the bottom surface of the upper positioning seat 17 and the upper surface of the cathode lower positioning seat 15 are provided with a plurality of positioning posts 18 evenly distributed in the circumferential direction at the end of the tube body 2, and a positioning bevel 19 is provided on the inner side of the positioning posts 18, The end of the pipe body 2 is in abutting contact with the corresponding positioning inclined surface 19.

[0060] Compared with the traditional gripping hand or fixing block which clamps the outer and inner sides of the pipe body 2 respectively, the contact position of the gripping hand or fixing block and the side surface of the pipe body 2 is tightly fitted, which makes it difficult to form a coating at the contact position. The abutting positioning manner of the positioning inclined surface 19 and the corresponding end of the tube body 2 will not affect the electroplating effect of the outer wall and the inner wall of the tube body 2.

PUM

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