Pipe electroplating device
A technology for electroplating equipment and pipes, applied in the electrolytic process, electrolytic components, etc., can solve the problems of unqualified copper pipe size, pipe burst, poor fluidity of electroplating liquid, etc.
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[0032] The present invention will be further described below with reference to the drawings and embodiments.
[0033] See Figure 1-Figure 4 , The tube electroplating equipment includes an electroplating tank 1 with a chemical solution (ie electroplating solution) inside and a tube body 2 arranged in the electroplating tank 1 and placed in the chemical solution. The inner wall of the tube body 2 constitutes an inner wall electroplating section 3. The outer wall electroplating section 21 is formed between the outer side surface of the body 2 and the inner wall of the electroplating tank 1, and also includes a feeding device for transporting chemical liquid to the inner wall electroplating section 3;
[0034] During the electroplating process of the tube electroplating equipment, the feeding device continuously transports the chemical liquid into the tube body 2 to supplement the copper ions consumed in the inner wall electroplating zone 3 during the electroplating process, and at th...
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