A kind of manufacturing method of mechanical blind hole and half hole

Abstract

The invention discloses a method for manufacturing mechanical blind holes and half holes, which comprises the following steps: drilling blind holes on the edge of a unit plate area on a production board, and half of the blind holes are located in the forming line area of ​​the production board; Drill a through hole with the same diameter as the blind hole at the molding line area next to the blind hole, and the through hole intersects the blind hole; then metallize the hole through copper sinking and full board plating; make the outer circuit on the production board , and in the process of making the outer layer circuit, after pattern electroplating, the molding line area next to the blind hole on the production board is removed first, and then the outer layer is etched to obtain the outer layer circuit and the blind hole half hole after metallization. The method of the invention can effectively solve the risk of no copper at the bottom of the half-hole blind hole by optimizing the production process, and can avoid the problem of cloaks and burrs on the edge of the half-hole blind hole, thereby ensuring the quality of the circuit board product.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing mechanical blind and half holes. Background technique [0002] Existing printed circuit board products meet the requirements of mounting components on the edge of the board, and the components only conduct part of the circuit layer on the printed circuit board, so it is necessary to design metallized blind holes and half holes (that is, semicircular holes) on the edge of the board. Blind holes) for mounting components. [0003] Due to the problem of the tinning ability of graphic electroplating, the copper at the bottom of the mechanical blind hole cannot be tinned smoothly to form an etching protection. As a result, when the outer layer is etched, the copper at the bottom of the mechanical blind hole is etched away, resulting in no copper at the bottom of the mechanical blind hole scrapped. Therefore, the conventional met...

AI Technical Summary

Problems solved by technology

[0005] 1. The added one-time electroplating process needs to be produced on the graphic electroplating line, which makes the production process complicated, greatly increases the production cost, and is prone to production errors;

[0006] 2. In the SET shape, the bottom of the mechanical blind hole is easy to oxidize. When electro-tinning is performed, there is no micro-etching process, which will easily lead to poor tin plating at the bottom of the mechanical blind hole, and cannot effectively protect the copper layer at the bottom of the mechanical blind hole;

[0007] 3. When the shape of the gong set is shaped, a cape will be formed on the edge of the board. After tinning, the cape will be protected by the tin layer. When the outer layer is etched, the cape cannot be etched away, resulting in short circuit and scrapping

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