2results about How to "Guaranteed plating effect" patented technology

This utility model discloses an electroplating tank assembly with an anti-jamming structure; it includes a mounting frame, an electroplating tank, an electrode head, and a sealing cover; a wave-shaped first adapter portion is provided recessed inward on the inner side wall of a limiting plate; when a product falls onto the limiting plate during loading, the first adapter portion on the limiting plate reduces the contact area between the limiting plate and the product, thereby causing the product on the limiting plate to fall into the electroplating tank. A second adapter portion, which mates with the first adapter portion, is provided recessed inward on the inner side of the sealing cover, with the first and second adapter portions located on the same plane after mating; even if a product falls onto the limiting plate, when the sealing cover is closed, the second adapter portion, which mates with the first adapter portion, presses the product on the first limiting portion into the electroplating tank, preventing the product from being clamped between the limiting plate and the sealing cover, thus ensuring the overall electroplating effect.

The application provides a gold electroplating device. The gold electroplating device is connected with the conductive panel and the conductive column through the turnover assembly, so that the short circuit and poor contact caused by the collision between different plates and the conductive tile due to the multiple blocks of the conductive plate and the rotary electrical connection are avoided. When the turnover mechanism turns the body out of the electroplating tank, the ratchet wheel is clamped on the ratchet teeth to fix the body and the turnover assembly, so as to turn the metal to be electroplated in the body. During the process that the turnover mechanism immerses the body into the electroplating liquid, the ratchet wheel and the ratchet teeth rotate freely, so that at least two conductive columns are located in the lower half of the body. Therefore, the short circuit is prevented, the electroplating effect of the bottom metal is ensured, the residual electroplating liquid on the surface of other metals is minimized when the other metals are taken out, and the cleaning cost is reduced.