Jet flow type electrochemical deposition device

Abstract

The invention discloses a jet flow type electrochemical deposition device. The device comprises an electroplating bath, wherein one or more jet flow mechanisms, cathodes and the anodes can be arrangedside by side in the electroplating tank, electrolysis on one or more substrates can be met, a substrate fixing frame is mounted in the electroplating tank, a substrate is mounted on the substrate fixing frame, the jet flow mechanisms are symmetrically arranged on the two sides of the substrate fixing frame, the jet flow mechanisms are provided with hollow shells, diaphragms and jet flow plates are mounted on the two sides of the jet flow mechanism respectively, cathode chambers are arranged on the side of the jet flow plates, and anode chambers are arranged on the side of the diaphragms. According to the device, through the design of the jet flow fixing plates, the diaphragms separate the catholyte in the cathode chamber and the anolyte in the anode chamber, an additive is not required tobe added in the solution in the anode chamber in the electrolysis process, the circular-shaped and the square-shaped jet flow plates are arranged, and the electrolysis of the plated objects in different shapes can be met, so that the electroplating effect of different plated objects is ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a jet-flow electrochemical deposition device. Background technique [0002] At present, the electroplating equipment used in industrial electroplating needs to reduce the thickness of the cathode film in order to increase the current density. Different methods are used to promote the flow of the solution to reduce the thickness of the cathode film. Some use mechanical stirring, some use air stirring, and some use cathode movement. Of course, there is also the method of using jet flow, and the plating speed can be improved to varying degrees. But each has its own disadvantages. The main disadvantages of the mechanical method are that the particles generated by the mechanical movement friction affect the quality of the electroplating, and the machinery itself is prone to failure, etc. The Eductor jet itself will shield the power line. The jet flow electroplating device has ...

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Problems solved by technology

[0004] The object of the present invention is to provide a jet-flow electrochemical deposition equipment to solve the following technical problems: (1) One or more jet flow mechanisms, cathodes, and anodes can be arranged side by side in the electroplating tank to meet the requirements for one or more substrates. The electrolysis at the bottom, through the design of the jet flow mechanism, the diaphragm separates the catholyte in the cathode chamber and the anolyte in the anode chamber. During the electrolysis process, there is no need to add additives to the solution in the anode chamber. The distribution of the jet holes can be adjusted according to different linings. The shape of the bottom can be adjusted to meet the electroplating effect of different shapes of objects to be plated. The jet plate is mainly circular, but not limited to a circle, which can meet the electrolysis of different shapes of objects to be plated, and solve the problem of electrolysis in the prior art. The technical problem of excessive consumption of additives caused by anodic oxidation during the process; (2) The diaphragm is set on the side of the anode chamber, far away from the cathode chamber, and the diaphragm can allow small ions to pass through, such as H+, etc., so that the cathode electrolysis can be separated Liquid and anolyte without affecting the passage of the power line, solving the problem of using an ion membrane to separate the cathode and anode in the electroplating process in the prior art, and it is easy to "infect" the shortcomings of the ion membrane itself to the plating layer

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