Dehydrating agent, preparation method of dehydrating agent, hydrocarbon water cutting agent and preparation method of hydrocarbon water cutting agent

A technology of hydrocarbon water cutting agent and dehydrating agent, which is applied in the field of chemical cleaning, can solve the problems of poor dehydration effect and long processing time, and achieve the effect of ensuring electroplating effect, high efficiency and good dehydration effect
CN112010773AInactive Publication Date: 2020-12-01SHENZHEN XINJUNXIANG TECHCAL

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN XINJUNXIANG TECHCAL
Publication Date
2020-12-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a dehydrating agent, a preparation method of the dehydrating agent, a hydrocarbon water cutting agent and a preparation method of the hydrocarbon water cutting agent, and relates to the technical field of chemical cleaning. The dehydrating agent comprises the following components in percentage by mass: 60-80% of an alcohol ether solvent, 5-10% of a phase transfer catalyst,10-20% of long-chain primary amine and 5-15% of short-chain carboxylic acid. The dehydrating agent provided by the invention has a good dehydrating effect and relatively high efficiency, the adsorption film on the surface of the part enables the part not to easily condense water and adsorb dust, and the dehydrating agent can be widely applied to electroplating pretreatment of the part, so that thesubsequent electroplating effect is ensured.
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Description

technical field

[0001] The invention relates to the technical field of chemical cleaning, in particular to a dehydrating agent and a preparation method thereof, a hydrocarbon water cutting agent and a preparation method thereof. Background technique

[0002] In the field of electronic components with higher and higher material requirements and processing precision requirements, the surface plating requirements for precision hardware parts have also become more stringent. The surface cleanliness in the traditional sense can no longer meet its processing requirements, so it is necessary to have Higher molecular-level cleanliness than traditional requirements is required to meet the nano-level surface plating conditions to meet the high-precision specifications and high-performance reliability of electronic components. Therefore, the cleaned parts must not have water stains left, and the cleaned parts must have a certain anti-wetting ability and surface electrostatic ability to...

Claims

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