Plating tank plated evenly

Abstract

The invention discloses a plating tank plated evenly. The plating tank comprises a tank body. Partition plates are fixedly connected to the tank body, and heating devices are further arranged on the tank body. Each partition plate is provided with an inclined plane, a sliding channel is formed in the corresponding partition plate, anode plates are connected in the sliding channels, and a filtering device is fixedly connected between the two partition plates, a water return pipe is arranged in the tank body. One end, located above the partition plates, of the water return pipe is connected with a telescopic pipe, the end, away from the water return pipe, of the telescopic pipe is connected with a tee pipe, the side faces of branch pipes of the tee pipe abut against the side faces the anode plates located on the partition plates penetrated by the water return pipe, and the outer side walls of the branch pipes are movably connected with blocking blocks. The positions of the anode plates can be adjusted according to requirements, the anode plates are convenient to assemble and disassemble, easy to replace and easy to locate in the mounting process, the plating bath foam temperature can be adjusted conveniently in the plating process, and plating bath foam can be recycled and filtered in real time.

Description

technical field [0001] The invention relates to an electroplating tank with uniform electroplating. Background technique [0002] Light-emitting diodes are referred to as LEDs for short, and lamps made of light-emitting diodes are called LED lights. In the process of making LED lights, light-emitting diodes need to be installed on LED brackets. When making LED brackets, copper strips need to be stamped, electroplated, injection molded, and punched. Forming and other steps, in which electroplating tanks need to be used in electroplating. The uneven distribution of power lines in common electroplating tanks results in uneven plating and general plating effects. In order to overcome this problem, some existing electroplating tanks have been improved. These electroplating tanks Although the tanks can be adjusted flexibly, the structure of these electroplating tanks is complicated, the anode plate or cathode plate is difficult to locate during installation, the impurities in the ...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems that the structure of the electroplating tank is complicated, the positioning of the anode plate or the cathode plate is difficult during installation, the impurities in the bath solution in the electroplating tank are difficult to filter, and the temperature of the electroplating bath solution is difficult to control

Images