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Circuit LED support and LED

A technology of LED bracket and LED chip, which is applied to circuits, electrical components, semiconductor devices, etc., can solve the problem of not being able to bear circuit wiring, etc., and achieve the effect of avoiding the increase in size and cost, simplifying the connection structure, and improving production efficiency.

Inactive Publication Date: 2019-11-19
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The circuit LED bracket and LED provided by the present invention mainly solve the technical problem of solving the problem that the existing LED bracket cannot undertake circuit wiring

Method used

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  • Circuit LED support and LED
  • Circuit LED support and LED
  • Circuit LED support and LED

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Embodiment Construction

[0044] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below through specific implementation manners in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0045] In order to solve the problems that the existing LED bracket can only protect the LED chip and lead out the positive and negative poles of the LED chip, but cannot bear the circuit wiring, this embodiment provides an LED bracket, The LED bracket provided in this embodiment has its own circuit, which is called a circuit LED bracket in this embodiment. The built-in circuit of the bracket can meet the requirements of combining the LED chip to be placed in the lamp bead area on the substrate with other lamp beads (which can be the same Other lamp beads ...

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Abstract

The invention provides a circuit LED support and an LED. The circuit LED support adopted by the LED comprises a conductive substrate and a circuit layer arranged on the conductive substrate and insulated and isolated from the conductive substrate, wherein the circuit layer comprises a circuit used for connecting a LED chip to be placed in a lamp bead area on the substrate with other lamp beads and / or connecting points of other devices on the substrate. The LED support can be directly connected with the other lamp beads or devices through the circuit layer of the LED support; a connection structure can be simplified, the increase of the size and the cost caused by the adoption of a circuit board can be avoided; and furthermore, the front surface of the conductive substrate of the circuit LED support provided by the invention is provided with at least one die bond region exposed out of the circuit layer and used for placing the LED chip to directly transfer heat generated by the LED chipduring work to the substrate and emit the heat at the fastest speed so as to better meet various application scenes, ensure the quality and the yield of the product, improve the production efficiencyof the LED product and further reduce the cost.

Description

technical field [0001] The invention relates to the field of LED (Light Emitting Diode, light emitting diode), in particular to a circuit LED bracket and an LED. Background technique [0002] With the development of LED technology and the application of various scenarios in various fields, LED structures that meet various needs have been produced. In various LED structures, LED brackets are basically used, and in order to meet various needs, LED brackets of various sizes, structures and materials have also been derived. However, the setting of the current LED support structure is only to carry the LED chip, protect the LED chip, and lead out the positive and negative poles of the LED chip. Various current LED brackets do not undertake circuit wiring. When in some application scenarios, it is necessary to electrically connect LEDs to other LEDs or to other devices, the electrical connection can only be realized through additional PCB board circuits. [0003] In addition, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64
CPCH01L33/62H01L33/64
Inventor 杨丽敏邢其彬曾学伟姚亚澜
Owner SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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