Double-sided wafer boat, wafer flipping device and wafer flipping method

A flip device, double-sided technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problem of wafer breakage easily, and achieve the effect of avoiding breakage, improving production efficiency, and ensuring productivity.

Active Publication Date: 2022-04-12
SHANGHAI IND U TECH RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The invention provides a double-sided wafer boat, a wafer flipping device and a wafer flipping method, which are used to solve the problem that the wafer is easily damaged during the flipping process in the prior art, so as to ensure the yield of wafer products and improve Wafer Production Efficiency

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  • Double-sided wafer boat, wafer flipping device and wafer flipping method
  • Double-sided wafer boat, wafer flipping device and wafer flipping method
  • Double-sided wafer boat, wafer flipping device and wafer flipping method

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Embodiment Construction

[0031] Specific implementations of the double-sided wafer boat, wafer inversion device and wafer inversion method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] In the prior art, the wafer boat is used as the carrier of the wafer, and usually only one side (generally the bottom surface of the wafer boat) is provided with a positioning structure, and the wafer processing machine is provided with an identification structure matching the positioning structure. The mutual matching of the structure and the marking structure defines the position of the wafer boat on the wafer processing machine, on the one hand to ensure the stable placement of the wafer inside the wafer boat, and on the other hand to ensure the smooth progress of the semiconductor processing process. The single-sided wafer boat can only be placed in the wafer processing tool with the surface having the positioning structure as the bottom su...

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a double-sided wafer boat, a wafer inversion device and a wafer inversion method. The double-sided wafer boat includes a cavity, and a first surface and a second surface located at opposite ends of the cavity; the cavity is used for accommodating wafers; the first surface is provided with a first positioning structure , and the second surface is provided with a second positioning structure. Both the first positioning structure and the second positioning structure are used to define the position of the double-sided wafer boat in the wafer processing machine. The invention fundamentally avoids the problem that the wafer is easily damaged during the flipping process, ensures the yield of the wafer product, and also improves the production efficiency of the wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a double-sided wafer boat, a wafer flipping device and a wafer flipping method. Background technique [0002] In the manufacturing process of semiconductor wafers, wafer boats, as the carrier of wafers, play an indispensable role in the production of semiconductor wafers. From wafer production to finished product testing, wafer boats are inseparable as carriers. For example, in the diffusion process using the furnace tube, the wafer is placed in the wafer boat first, and then the wafer boat is placed in the furnace tube for processing. [0003] On the one hand, with the continuous development of semiconductor wafer production technology, not only the front side of the wafer is required to be processed, but also the back side of the wafer is required to be processed, which makes it necessary to flip the wafer during the wafer production process. On the other ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/68H01L21/687
CPCH01L21/67326H01L21/68H01L21/68764
Inventor 高明昕张成明卢文进马仁月
Owner SHANGHAI IND U TECH RES INST
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