Automatic adsorbing device used for array waveguide grating (AWG) and pasting method

Abstract

The invention discloses an automatic adsorbing device used for an array waveguide grating (AWG). The automatic adsorbing device comprises a center support, an adsorbing platform and an air guide pipe,wherein the adsorbing platform is arranged at the top end of the center support, the air guide pipe is arranged at one side of the center support, one end of the air guide pipe is connected to an airpump source, and the other end of the air guide pipe is connected to the adsorbing platform; multiple suction holes are formed in the adsorbing platform, the air guide pipe is communicated with the suction holes, an optical quartz substrate is detachably fixed to the end face of the adsorbing platform, and an AWG chip is pasted on the upper surface of the optical quartz substrate. The automatic adsorbing device is simple in structure and convenient to operate and use, makes mass production easy, improves production efficiency and reduces material and manpower cost, and an electric system operates more stably.

Description

technical field [0001] The invention relates to the field of optical fiber communication, in particular to an automatic adsorption device and a pasting method for an arrayed waveguide grating (AWG). Background technique [0002] Arrayed waveguide grating (AWG) is an important optical device based on planar optical waveguide integration technology. With the rapid development of communication technology and its business, the research of large-capacity optical fiber communication system has great application value. Arrayed waveguide grating is the most ideal optical device to realize multi-channel dense wavelength division multiplexing optical network. It is also the basic optical communication technology for backbone optical transmission network and metropolitan core network. It has become the basis of optical communication network. It has wavelength multiplexing / demultiplexing functions, and wavelength multiplexing and demultiplexing devices are the basic devices of this tech...

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Problems solved by technology

At the same time, due to the inherent characteristics of the curve of the AWG chip, and the influence of the AWG chip material (single crystal silicon) with high hardness, poor brittleness, and thin thickness, the clamping and coupling process of AWG device production is more difficult. In the process, due to improper operation, it is very easy to cause scrapping of AWG chips, resulting in high production costs

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