A kind of manufacturing method of TFT backplane
A manufacturing method and backplane technology, applied in semiconductor/solid-state device manufacturing, instruments, semiconductor devices, etc., can solve problems such as color distortion, achieve the effect of improving color distortion and improving competitiveness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0026] In order to facilitate those skilled in the art to understand the technical solution of the present invention, the technical solution of the present invention will be further described in conjunction with the accompanying drawings.
[0027] A method for manufacturing a TFT backplane, comprising the following steps:
[0028] In the first step, a base substrate 10 is prepared. Then a first buffer layer 21 is formed on the base substrate 10 , and a second buffer layer 22 is formed on the first buffer layer 21 .
[0029] In the second step, several gates 30 and pixel electrodes 40 are formed on the second buffer layer 22 , and the gates 30 and pixel electrodes 40 are arranged at intervals.
[0030] In the third step, a first insulating layer 51 is formed on the surface of the non-covered area of the second buffer layer 22 and the surface of the gate 30 and the pixel electrode 40, and several arc-shaped recesses 52 are uniformly arranged on the first insulating layer 51. ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com