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A kind of brush type highly durable chemical mechanical polishing polyurethane material and preparation method thereof
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A polyurethane material and chemical-mechanical technology, applied in the field of polyurethane materials, can solve the problem that semiconductor materials cannot be polished well, and achieve the effects of good use value and promotion value, improved trimming, good toughness and hardness
Active Publication Date: 2022-03-08
ANHUI ANLI MATERIAL TECH
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[0005] The purpose of the present invention is to make up for the defects of the prior art, to provide a brush-type high-durability chemical-mechanical polishing polyurethane material and its preparation method, so as to solve the problem that the incision or arc-shaped section of the semiconductor material in the prior art cannot be polished well processing problem
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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Embodiment 1
[0034] In this embodiment, the brush type highly durable chemical mechanical polishing polyurethane material and its preparation method are as follows:
[0035] 1. The raw material components of the polyurethane slurry and the parts by weight of each raw material component are as follows:
[0036]
[0037]
[0038] The viscosity of the polyurethane slurry is 700mPa·s / 20-30°C.
[0039] The polyurethane resin SW-4550 resin, isocyanate-terminated polyurethane prepolymer contains 5% by weight of unreacted isocyanate groups.
[0040] 2. The non-woven fabric is used as the base material, and the impregnated polyurethane slurry is forcedly extruded by six wet rollers, and then coagulated, washed, and dried to obtain chemically mechanically polished polyurethane material crust leather.
[0041] Among them, six-roll forced extrusion impregnation such as figure 2 shown.
[0042] The thickness of the non-woven fabric is 3.5 mm.
[0043] The six pairs of rollers are impregnated...
Embodiment 2
[0047] In this embodiment, the brush type highly durable chemical mechanical polishing polyurethane material and its preparation method are as follows:
[0048] Wherein the polyurethane slurry raw material component and the parts by weight of each raw material component are as follows:
[0049]
[0050] The viscosity of the polyurethane slurry is 200mPa·s / 20-30°C.
[0051] The polyurethane resin SW-4550 resin, isocyanate-terminated polyurethane prepolymer contains 5% by weight of unreacted isocyanate groups.
[0052] Other steps and technology are according to embodiment 1.
Embodiment 3
[0054] In this embodiment, the brush type highly durable chemical mechanical polishing polyurethane material and its preparation method are as follows:
[0055] Wherein the polyurethane slurry raw material component and the parts by weight of each raw material component are as follows:
[0056]
[0057]
[0058] The viscosity of the polyurethane slurry is 1200mPa·s / 20-30°C.
[0059] The polyurethane resin SW-4550 resin, isocyanate-terminated polyurethane prepolymer contains 5% by weight of unreacted isocyanate groups.
[0060] Other steps and technology are according to embodiment 1.
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Abstract
The invention discloses a brush-type high-durability chemical-mechanical polishing polyurethane material and a preparation method thereof. The raw materials are non-woven fabric, multifunctional isocyanate, prepolymer polyol and wear-resistant inorganic materials, and the non-woven fabric is used as the base material. The impregnated polyurethane slurry is forcedly extruded by six wet rollers to effectively increase the polyurethane impregnation of the base material. After agglomeration, washing and drying, a chemically mechanically polished polyurethane material leather is obtained; A brush-type highly durable chemical mechanical polishable polyurethane material. It can be used for chemical mechanical polishing of incisions or arc-shaped sections in semiconductor materials, optical devices, electronic display devices, and precious metal materials, and solves the problem that the existing plane grinding and polishing technology cannot solve the problem of semiconductor material incisions or arc-shaped sections. The polishing problem fills in the technical deficiencies of horizontal surface polishing, and further technical problems of polishing such as incision or arc-shaped cross-section.
Description
technical field [0001] The invention belongs to the technical field of polyurethane materials, in particular to a brush type highly durable chemical mechanical polishing polyurethane material and a preparation method thereof. Background technique [0002] Chemical Mechanical Polishing (CMP) can provide surface planarization in the manufacturing process of integrated circuits, semiconductor materials and optical glass, and can realize ultra-precision and damage-free surface processing. At present, the commonly used chemical mechanical polishing polyurethane materials are usually used as flat mirror polishing, and are mainly used in surface grinding equipment, and the polishing effect is relatively good. However, for the polishing of incisions or arc-shaped cross-sections of semiconductor materials, the usual flat polishing methods and materials cannot meet the requirements. At present, the polishing problems of incisions or arc-shaped cross-sections of polished materials are ...
Claims
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