Efficient multi-freedom-degree ultrasonic vibration assisted double-sided laser machining device
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- TIANJIN POLYTECHNIC UNIV
- Publication Date
- 2019-12-06
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Abstract
Description
technical field
[0001] The invention belongs to the field of ultrasonic vibration composite laser processing, in particular to a high-efficiency multi-degree-of-freedom ultrasonic vibration-assisted double-sided laser processing device. Background technique
[0002] With the continuous development of laser processing technology, laser has been applied to the processing of various materials, such as metals, polymers, composite materials, etc.; For materials with melting point, laser processing has good applicability, for example, its high processing quality, high processing efficiency, wide range of processing materials, and micro-hole processing can be realized; due to these excellent characteristics of laser processing, it has been used in high-end cutting-edge aviation related fields.
[0003] In recent years, some scholars and researchers have done a lot of research on laser processing. For example, the patent (201721633214.8) proposed an ultrasonic vibration-assisted la...