Process for producing contacts on electrical components suitable for flip-chip assemble

Abstract

In a process for producing contacts on OFW components suitable for a flip-chip assembly, in which electrically conductive structures (3) on a substrate (1) are encapsulated by a cover (2), after the cover (2) has been produced, solderable layers (4) in contact with pads of the electrically conductive structures (3) are applied.

Description

technical field [0001] The invention relates to a manufacturing method of an electric component contact electrode suitable for flip-chip assembly. Background technique [0002] In the earlier German patent registration P 444 15 411.9 an encapsulation of electronic components is described with a hermetic enclosure enclosing the component structure on the substrate, wherein the enclosure consists of a cover layer arranged on the substrate, It has recesses in the area of ​​the element structures to accommodate these element structures. Such an encapsulation protects the component structure from environmental influences, so the electronic components packaged in this way can be put into use directly without additional housing. [0003] As components become more miniaturized, minimum housing volume and a low construction height are required. This requirement applies, for example, to electronic components for chip cards such as telephone cards or food cards. Components with pack...

AI Technical Summary

Problems solved by technology

Here, a solderable layer with bumps must be selectively provided at the connection surface (pad) of the component system, so a series of process steps are required for this purpose, and these steps are very difficult especially for OFW components. because of the increased possibility of short circuits due to overlapping planar fingers

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