The invention relates to a method for detecting the critical
cutting depth of a hard and brittle
ceramic material. The method comprises the following steps of: (1), firstly, sticking a thin
gasket on a basal disc, taking a polished hard and brittle
ceramic material slice with an ultra-
smooth surface and without scratches as a work-piece slice, and putting the work-piece slice on the thin
gasket to be stuck, so that the work-piece slice forms a tiny slope; (2), enabling the particle size number,
processing load,
processing rotation speed and
processing liquid of a
grinding disc to be the same to those under experimental processing conditions, wherein
abrasive particles form micro
cutting marks from shallow to deep on the surface of the work-piece slice during processing; and (3), tracking and observing the
cutting marks of the
abrasive particles in a processing transition area by adopting a
white light interferometer, finding out the cutting marks, with obvious plastic and brittle conversion characteristics, of the
abrasive particles, finding out a first fragmental crack, and carrying out two-dimensional outline analysis on the first fragmental crack, wherein the cutting mark depth of the fragmental crack is defined as the critical cutting depth of the hard and brittle
ceramic material. The method disclosed by the invention has the advantages of high detection precision and good reliability.