Method for detecting critical cutting depth of hard and brittle ceramic material

A critical cutting depth, ceramic material technology, used in measuring devices, instruments, optical devices, etc., can solve the problems of poor reliability and poor detection accuracy, and achieve the effect of consistent processing conditions, high accuracy and high resolution

Active Publication Date: 2012-07-11
ZHEJIANG UNIV OF TECH
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Problems solved by technology

[0006] In order to overcome the shortcomings of poor detection accuracy and poor reliability of the existing detection technology for the critical depth of cut of hard and brittle ceramic materials, the present invention provides a detection method for the critical depth of cut of hard and brittle ceramic materials with high detection accuracy and good reliability

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  • Method for detecting critical cutting depth of hard and brittle ceramic material
  • Method for detecting critical cutting depth of hard and brittle ceramic material
  • Method for detecting critical cutting depth of hard and brittle ceramic material

Examples

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example 1

[0026] Example 1: The critical cutting depth of single crystal silicon is not only related to its own material properties, but also many other influencing factors. Among them, the cutting depth of plastic-brittle transition of cuts with different widths is different. Generally, wide cuts are prone to brittle fracture, and narrow cuts are prone to plastic cutting. It is generally believed that the width of cuts is determined by the size of abrasive grains. However, in the inspection of the processing area, it will be found that some wide cut marks are still plastic cutting when the cutting depth is deep, and some narrow cut marks appear brittle fracture when the cutting depth is shallow. Therefore, the cutting must be considered comprehensively. The width and depth of the mark. Since the shape of the cut mark of the workpiece is formed by cutting with a round edge, the radius of the round edge of the abrasive particle tip takes into account the width and depth of the cut mark, s...

example 2

[0031] Example 2: The main crystal planes of single crystal silicon are {100}, {110} and {111}, and their interplanar spacing, areal density and bond density are all different, so single crystal silicon crystal has the characteristics of anisotropy. The {111} crystal planes have the largest atomic density and the highest elastic modulus, but the interplanar spacing is large, and the atomic bond density on the planes is low, and the {111} crystal planes are relatively fragile. The elastic modulus and atomic bonds of the {110} crystal plane are second only to the {111} crystal plane. {100} The crystal plane spacing is the smallest and the bond density is the largest. Therefore, single crystal silicon crystals are most likely to be cleaved along the {111} crystal plane at room temperature, and the {111} crystal plane is the second cleavage plane. At present, the most commonly used in the semiconductor industry are single crystal silicon wafers with {100} crystal faces and {111} c...

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Abstract

The invention relates to a method for detecting the critical cutting depth of a hard and brittle ceramic material. The method comprises the following steps of: (1), firstly, sticking a thin gasket on a basal disc, taking a polished hard and brittle ceramic material slice with an ultra-smooth surface and without scratches as a work-piece slice, and putting the work-piece slice on the thin gasket to be stuck, so that the work-piece slice forms a tiny slope; (2), enabling the particle size number, processing load, processing rotation speed and processing liquid of a grinding disc to be the same to those under experimental processing conditions, wherein abrasive particles form micro cutting marks from shallow to deep on the surface of the work-piece slice during processing; and (3), tracking and observing the cutting marks of the abrasive particles in a processing transition area by adopting a white light interferometer, finding out the cutting marks, with obvious plastic and brittle conversion characteristics, of the abrasive particles, finding out a first fragmental crack, and carrying out two-dimensional outline analysis on the first fragmental crack, wherein the cutting mark depth of the fragmental crack is defined as the critical cutting depth of the hard and brittle ceramic material. The method disclosed by the invention has the advantages of high detection precision and good reliability.

Description

Technical field [0001] The invention relates to the processing technology field of the plastic domain of hard and brittle ceramic materials, in particular to a method for detecting the critical cutting depth of hard and brittle ceramic materials. Background technique [0002] Hard and brittle ceramic materials are processed in the plastic domain, and the surface quality of the workpiece after processing is good, and the surface and subsurface damage layers are small. But its complete plastic domain processing requires that the cutting depth of all abrasive grains is below the critical cutting depth. Therefore, the critical cutting depth of hard and brittle ceramic materials is a key indicator for achieving plastic domain processing. [0003] According to literature search, in the past, the critical cutting depth of hard and brittle ceramic materials was studied based on indentation fracture mechanics, that is, the diamond indenter was pressed into the material to a certain depth w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/22
Inventor 吕迅袁巨龙李志鑫
Owner ZHEJIANG UNIV OF TECH
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