MEMS microphone and preparation method thereof

Abstract

The invention provides an MEMS microphone and a preparation method thereof, and relates to the field of acoustoelectric conversion. According to the invention, the groove is formed in the substrate; the MEMS chip is welded at the bottom of the groove; the diaphragm of the MEMS chip is ensured to be parallel to the bottom surface of the groove; the MEMS chip and the substrate are respectively contacted and welded with the same side surface of the ASIC chip; the metal cover is covered on the substrate; a packaging cavity for packaging the groove, the MEMS chip and the ASIC chip is formed on thesubstrate; a sound transmission hole is formed in the side wall of the groove; the surface, located outside the packaging cavity, of the substrate is provided with a sound inlet hole. A sound transmission channel is arranged in the substrate, and the sound transmission channel is communicated with the sound transmission hole and the sound inlet hole, so that the sound pressure of a sound signal entering the microphone is not in direct opposite contact with the vibrating diaphragm of the MEMS chip, the problem that the vibrating diaphragm is easy to break due to high-strength sound pressure issolved, the service life of the microphone is prolonged, and the use experience of a user is improved.

Description

technical field [0001] The present application relates to the field of acoustic-electric conversion, in particular to a MEMS microphone and a preparation method thereof. Background technique [0002] With the rapid development of semiconductor manufacturing technology, semiconductor devices are widely used in various electronic products to ensure the realization of functions of the corresponding electronic products. Among them, for sound collection equipment (such as smart phones, recorders), microphones manufactured based on semiconductor devices can be used to convert sound signals into electrical signals, and through the small size and stable Strong and other characteristics, enhance the performance of sound collection equipment. [0003] But for now, the microphones on the market based on semiconductor devices make the diaphragm of the MEMS (Micro Electro Mechanical System, micro-electro-mechanical system) face the near-sound direction of the sound signal, so as to ensu...

AI Technical Summary

Problems solved by technology

During this process, because the diaphragm of the MEMS chip is in direct contact with the sound pressure, when the intensity of the sound pressure change exceeds a certain value, the diaphragm of the MEMS chip is prone to rupture under the impact of high-intensity sound pressure, resulting in MEMS The chip is damaged, affecting the service life of the microphone and user experience

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