Method for avoiding residual glue at stepped position of stepped plate

Abstract

The invention relates to a method for avoiding residual glue at a stepped position of a stepped plate, and the method comprises the following steps: manufacturing a silk-screen blocking point net, andsetting a stamp-pad ink area at a position for avoiding residual glue on the surface of the stepped plate; manufacturing an exposure film according to a stepped region D-10mil; performing silk-screenexposure on the whole board, and performing the exposure curing of an oil layer covering the position for preventing residual glue; performing developing, and washing off the oil layer of the non-exposed part through liquid medicine; performing baking: curing the wet film formed by the oil layer by baking; performing plate pressing, performing the pressing of the stepped plate according to the plate manufacturing requirement, and employing prepreg or prepreg powder as a medium for pressing to obtain a pressing plate; opening a cover and withdrawing a die: opening the cover after the pressingprocess in the step S6 is completed, placing the pressing plate in liquid medicine, and washing off the wet film covering the position for preventing residual glue; and performing drying: taking out the laminated plate after the film is successfully stripped, and performing drying to finish the plate making of the laminated plate. The problem of adhesive residue is conveniently and quickly solved,the covering precision is high, and the flatness of the surface of the step plate is well protected.

Description

technical field [0001] The invention relates to the field of stepped plate making, in particular to a method for preventing residual glue at the stepped position of the stepped plate. Background technique [0002] During the lamination process of the stepped plate, due to the influence of the hot-melt diffusion of the prepreg powder, glue is often stuck to the exposed position of the steps, resulting in the formation of residual glue after lamination that is difficult to remove. At present, the exposed position of the stepped plate is pretreated by manually pasting high temperature resistant tape. Before lamination, the step position is covered with high-temperature-resistant tape to protect it. The disadvantage is that it takes a long time to manually apply high-temperature-resistant tape, the cost of high-temperature-resistant tape is high, and the tape needs to be manually torn off after the lamination is completed. Another method is to perform grinding after pressing an...

AI Technical Summary

Problems solved by technology

Before lamination, the step position is covered with high-temperature-resistant tape to protect it. The disadvantage is that it takes a long time to manually apply high-temperature-resistant tape, the cost of high-temperature-resistant tape is high, and the tape needs to be manually torn off after the lamination is completed.

Another method is to perform grinding after pressing and opening the cover. This method consumes more resources and requires high precision during grinding. The operation is difficult and the step plate is easily damaged.

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