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Method for transferring micro-light emitting diodes, micro-light emitting diode device and electronic device

A technology of micro-light-emitting diodes and transfer methods, which is applied in the direction of circuits, electrical components, and electric solid-state devices, can solve problems such as mismatch and lower product quality, and achieve the effects of easy control, avoiding heating, and easy programming control

Active Publication Date: 2019-12-06
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high temperature required for bonding, the original substrate 1 and the receiving substrate 2 are mismatched due to thermal expansion, reducing product quality

Method used

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  • Method for transferring micro-light emitting diodes, micro-light emitting diode device and electronic device
  • Method for transferring micro-light emitting diodes, micro-light emitting diode device and electronic device
  • Method for transferring micro-light emitting diodes, micro-light emitting diode device and electronic device

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Embodiment Construction

[0031] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0032] figure 2 Schematically shows an embodiment of the micro light emitting diode transfer method of the present invention, as figure 2 As shown, the method includes the following steps:

[0033] Step S110 , disposing a bonding agent block on the electrode pads of the receiving substrate and / or on the micro light emitting diodes of the original substrate. Usually, one bonding agent block is arranged on each receiving electrode pad or one bonding agent block is arranged on each micro light emitting diode to be transferred.

[0034] Step S120, aligning and contacting the electrode pads of the receiving substrate and the micro-light emitting diodes of the original substrate, so that the bonding agent block is located between the micro-light-e...

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Abstract

The present disclosure discloses a method for transferring micro-light emitting diodes, a micro-light emitting diode device and an electronic device. The method for transferring micro-light emitting diodes comprises: providing bumps of bonding agent on electrode bonding pads of a receiving substrate and / or on micro-light emitting diodes of an original substrate; aligning and contacting the electrode bonding pads of the receiving substrate and the micro-light emitting diodes of the original substrate, to position the bumps of bonding agent between the micro-light emitting diodes and the electrode bonding pads; irradiating locally by using a first laser from the original substrate side, to melt the bumps of bonding agent to bond the micro-light emitting diodes and the electrode bonding pads;and stripping off the micro-light emitting diodes from the original substrate, to transfer the micro-light emitting diodes to the receiving substrate. The present disclosure, by heating quickly and locally by laser irradiation, avoids the overall warming-up of the receiving substrate and the original substrate, reduces the heat mismatch phenomenon, optimizes the flow of the bonding of the micro-light emitting diodes, and facilitates the controlling.

Description

technical field [0001] The invention relates to the technical field of micro light emitting diodes, in particular to a micro light emitting diode transfer method, a micro light emitting diode device and an electronic device. Background technique [0002] Micro-light-emitting diode (Micro LED) technology refers to the manufacture of micro-light-emitting LED devices by integrating high-density micro-sized LED arrays on a substrate to achieve thinning, miniaturization and matrixization of micro-light-emitting LED devices. The distance between adjacent pixels in this LED array reaches the micron level, and the LED device realized by it is small in size, low in power consumption, high in brightness, and has ultra-high resolution and color saturation. Moreover, the response speed of the micro-LED array is faster and the lifespan is longer. [0003] When making and using micro-light emitting diodes, micro-light-emitting diodes need to be produced on a growth substrate, and cannot ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
CPCH01L25/0753H01L33/32H01L33/62H01L2933/0066H01L33/0093H01L2224/95
Inventor 邹泉波陈培炫
Owner GOERTEK INC
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