This invention provides a light-emitting
diode epitaxial
wafer and its fabrication method. The light-emitting
diode epitaxial
wafer includes a substrate, and a buffer layer, an undoped GaN layer, an N-type GaN layer, a
multiple quantum well layer, an
electron blocking layer, and a P-type GaN layer sequentially deposited on the substrate. The buffer layer includes a nitrided
graphene buffer layer, an h-BN buffer layer, and a B-type GaN layer sequentially deposited on the substrate. x Al 1‑x N buffer layer, AlN buffer layer, wherein, the B x Al 1‑x The
boron content in the N-buffer layer gradually decreases along the growth direction of the epitaxial layer. This invention achieves this by sequentially arranging a
graphene nitride buffer layer, an h-BN buffer layer, and a
boron buffer layer between the substrate and the epitaxial structure. x Al 1‑x N-buffer
layers and AlN-buffer
layers reduce
lattice mismatch between structures, lower defect density, and improve the overall quality of LED epitaxial wafers.