Silicon carbide surface-enhanced aluminum heat dissipation substrate and manufacturing method thereof
A technology of surface enhancement and aluminum substrate, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as complex process, high cost, and aluminum-based cost-effectiveness, and achieve improved thermomechanical properties, Not easy to crack growth, reduce thermal fatigue failure and the generation and expansion of cracks
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0024] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0025] An embodiment of the present invention provides an aluminum heat dissipation substrate with a silicon carbide surface enhanced, figure 1 It is an aluminum heat dissipation substrate with silicon carbide layers on the upper and lower surfaces. figure 2 It is a schematic diagram of nano-silicon carbide particles forming a silicon carbide layer on the surface of an aluminum substrate through a laser or electron beam sintering process. Place the aluminum substrate 1 on the workbench 5, the workbench can be fed horizontally, and evenly spread nano-silicon carbide ceramic particles 3 on the aluminum substrate 1, wherein the particle size of the nano-silicon carbide ceramic particles is 20nm-30nm; Moving forward, the nano silicon carbide ceramic particles 3 are uniformly sintered into the silicon carbide layer 2 by laser beam or electron beam 4 . Aft...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com