High-power LED lighting package structure for vehicle lamp

Abstract

The invention discloses a high-power LED lighting packaging structure for vehicle lamps, which includes a high-purity aluminum plate, a diamond-like coating, a conductive layer, white silica gel, an LED chip, a packaging layer, liquid phase fusion and a fluorescent adhesive film; The aluminum plate is provided with a diamond-like coating, a conductive layer is provided on the diamond-like coating, a liquid phase fusion is provided on the conductive layer, a chip array composed of more than one LED chip is provided on the liquid phase fusion, and a package is provided on the LED chip. layer and / or fluorescent adhesive film, and a white silicone package is provided on the periphery of the chip array. The high-power LED lighting package structure for car lights of the invention can withstand high driving current, has low cost, low thermal resistance of the system, high light efficiency, and meets the high integration requirements of car lighting.

Description

technical field [0001] The invention relates to a high-power LED lighting device for vehicle lights, in particular to a high-power LED lighting device directly using a superconducting copper-clad aluminum substrate as a heat dissipation channel. Background technique [0002] With the advancement of LED chip materials and processes, the light efficiency of high-power LEDs has been gradually improved, and more and more LEDs are currently used in the field of automotive lights. The photoelectric conversion efficiency of LED chips is currently only 40-50%, and the operating temperature of high-power LEDs will rise sharply as the driving current increases. Due to the small size of the LED chip is generally about 1mm 2 , if the heat cannot be dissipated in time, it will not only affect the luminous efficiency of the LED, but even cause it to burn out. [0003] At present, aluminum nitride, aluminum oxide or copper-based copper-clad laminates are generally used as the heat dissip...

AI Technical Summary

Problems solved by technology

Due to the small size of the LED chip is generally about 1mm 2 , if the heat cannot be dissipated in time, it will not only affect the luminous efficiency of the LED, but even cause it to burn out

[0003] At present, aluminum nitride, aluminum oxide or copper-based copper-clad laminates are generally used as the heat dissipation and conductive structure of LED chips for LED packaging for car lights. Aluminum nitride and copper-based copper-clad laminates are expensive and inconvenient to process, while aluminum oxide has a low thermal conductivity. Only 17~22w / m.k, because car lights need to combine multiple LEDs to increase power, which severely restricts the application of LEDs in car lights

Images