Cooking utensil and method for controlling temperature
A technology for cooking utensils and temperature changes, which is applied in the field of kitchen utensils and can solve problems such as inconvenient use, loss of food nutrition, and coking
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Embodiment 1
[0055] Such as Figure 1-2 As shown, the present invention relates to a temperature-controllable cooking utensil, comprising a housing 3, an electromagnetic generating device 5 disposed in the housing 3, a panel 1 disposed above the electromagnetic generating device 5, and electrically connected to the electromagnetic generating device 5 The control unit 4 and the heating device 2 connected to the control unit, a pot 6 is arranged above the panel 1, at least a part of the panel 1 is a temperature-sensitive layer 11 capable of sensing the electromagnetic signal generated by the electromagnetic generating device 5. The electromagnetic generating device 5 is mainly composed of an electromagnetic heating coil, a signal generating unit, and a signal receiving unit, and the electromagnetic heating coil is electrically connected to the signal generating unit and the signal receiving unit respectively. The electromagnetic generating device is used to generate an electromagnetic field....
Embodiment 2
[0088] This embodiment has been improved on the basis of embodiment 1, as image 3 As shown, the panel of the present embodiment is provided with a pot 6, and the pot 6 includes a pot body and a pot bottom. Bottom or pan body, not set in panel 1. The bottom of the pot 6 can be made of a layer of metal, and can also be made of multiple layers of metal composites, such as aluminum layers, steel layers, etc., and the temperature-sensitive layer can be arranged on the pot The upper surface of the bottom of 6 can also be arranged on the lower surface, and can also be arranged between the upper and lower surfaces of the bottom of the pot 6 . For a pot capable of three-dimensional heating, the temperature-sensing layer 11 can also be arranged on the body of the pot.
[0089] The rest of the structure of this embodiment is the same as that of Embodiment 1.
Embodiment 3
[0091] This embodiment improves the temperature-sensing layer on the basis of Embodiment 1. The temperature-sensing layer 11 is provided with at least one through hole, and usually several through holes are evenly arranged. The percentage of the total area of the temperature layer is 5%-50%. This setting can not only save the production cost of the temperature-sensing layer 11, but also satisfy the function of the temperature-sensing layer to the greatest extent.
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Abstract
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