Processing method for laminating thick-copper thin cover film

Abstract

The invention discloses a processing method for laminating a thick-copper thin cover film, which comprises the steps of S1, laminating a bearing film on the end surface of the cover film before the cover film is processed according to an FPC processing flow; S2, aligning the FPC and the cover film through a sleeving jig; S3, carrying out false pressing on the FPC with the cover film, and fixing the relative position between the cover film and the FPC; S4, performing hot pressing by using a vacuum quick pressing machine to enable the glue to be fully bonded with the copper surface of the FPC; and S5, tearing off the bearing film on the surface of the cover film after the FPC is subjected to thermal lamination so as to finish the processing. The laminating difficulty of a thin cover film issolved, and the operability of selecting and attaching the bearing film is improved; the pyrograph laminating before hot pressing is additionally carried out, the temperature is lower than that of thehot pressuring, glue overflowing is not likely to happen, and the whole PFC can be slightly bonded together; and vacuum lamination is adopted for hot pressing, and air bags are used for filling and laminating, thereby not only being capable of preventing the cover film from being broken, but also being capable of enabling the cover film to be effectively compacted.

Description

technical field [0001] The invention relates to the technical field of manufacturing flexible circuit boards, in particular to a processing method for laminating thick copper and thin covering films. Background technique [0002] Generally, FPC (flexible circuit board) is directly heat-pressed with a fast press according to the set parameters after the cover film is pasted, but the wireless charging FPC is a special product, and the characteristics compared with the conventional FPC: surface copper thickness, PI of the cover film Both the adhesive and the glue are thin, and if conventional lamination is used, two problems will arise: the cover film will move during lamination, and the hot press of the fast press will break the cover film and expose copper, which is unacceptable to customers. In order to solve the pressing problem of the wireless charging FPC cover film and provide reliability guarantee for the function of the wireless charging FPC, it is necessary to develop...

AI Technical Summary

Problems solved by technology

[0005] In order to meet the above-mentioned requirements, the purpose of the present invention is to provide a processing method for laminating thick copper and thin cover films, aiming to solve the problem of cover film displacement during thermal pressing between cover film and FPC (especially the window opening position of cover film) , due to the nearby thick copper and line gap filling, the cover film is pulled and the window is shifted), the cover film and the FPC are pressed together to cause the cover film to break, and to avoid the wrinkle caused by the product deformation after the traditional method is pressed. Discount risk

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