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Conductive film for sound production device, and sound production device

A technology of a sounding device and a conductive film, which is applied in the directions of flat diaphragms, electrical components, diaphragm structures, etc., can solve the problems of high cost, low reliability and acoustic performance, and low mass producibility, and achieve stable vibration and avoidance. The effect of voice coil lead wire breakage and good electrical conductivity

Active Publication Date: 2019-12-13
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above-mentioned methods all have the defects of high difficulty in technical realization, low mass production, high cost, low reliability and low acoustic performance to varying degrees.

Method used

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  • Conductive film for sound production device, and sound production device
  • Conductive film for sound production device, and sound production device
  • Conductive film for sound production device, and sound production device

Examples

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Embodiment Construction

[0038] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0039] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0040] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0041] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a conductive film for a sound production device, and the sound production device. The first base material layer and the second base material layer are attached to the two surfaces of the conducting layer; wherein the first base material layer is connected with one surface of the conducting layer through a first adhesive layer in a hot pressing mode, and then a conducting circuit is formed on the conducting layer through etching; the first adhesive layer has adhesive force at the hot pressing temperature and does not have adhesive force at the room temperature. One technical effect of the invention is that the conductive film has conductivity, can be used as a sound production diaphragm, and can also be used as a conductive support diaphragm.

Description

technical field [0001] The present invention relates to the technical field of electroacoustic conversion, and more specifically, the present invention relates to a conductive film used for a sound generating device and the sound generating device. Background technique [0002] The sound generating device generally includes a diaphragm and a voice coil combined on one side of the diaphragm, and also includes electrical connectors for electrically connecting the internal circuit and the external circuit of the sound generating device. Among them, the voice coil includes two voice coil lead wires, and the two voice coil lead wires are respectively electrically connected to the two pads of the electrical connector by means of spot welding. Controls the electrical signal in the voice coil. [0003] Generally speaking, the lead wire of the voice coil needs to run out a certain length of thread to realize the electrical connection with the electrical connector. However, in the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R7/10H04R9/02H04R9/06
CPCH04R7/10H04R9/02H04R9/06H04R2307/025H04R2307/027
Inventor 赵国栋何超锋
Owner GOERTEK INC
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