Method for detecting alignment between adjacent layers of multilayer printed circuit board
A technology of multi-layer printing and detection method, applied in the directions of printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of printed circuit board damage, time-consuming, unsuitable for batch alignment detection, etc.
Active Publication Date: 2019-12-13
ELEC & ELTEK GUANGZHOU ELECTRONICS
View PDF5 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
At present, the measurement method of micro-section is usually used to measure the alignment between adjacent layers, but this method takes a long time and is locally destructive to the printed circuit board, so it is not suitable for batch alignment detection
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] This part will describe the specific embodiment of the present invention in detail, and the preferred embodiment of the present invention is shown in the accompanying drawings. Each technical feature and overall technical solution of the invention, but it should not be understood as a limitation on the protection scope of the present invention.
[0026] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
[0027] r...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for detecting alignment between the adjacent layers of a multilayer printed circuit board. The method comprises the following steps that: each inner-layer board is provided with an x-direction detection module, each x-direction detection module is provided with a first pad; and each first pad is provided with a first inner-layer wire; the inner-layer boards are laminated into a multilayer printed circuit board; a left through hole and a right through hole are formed in the multilayer printed circuit board, the first pads are correspondingly arranged between theleft through hole and the right through hole; in a from-back-to-front direction, distances between the first pads and the left through hole are gradually increased, and distances between the first pads and the right through hole are gradually reduced; the first inner-layer wires are connected to an outer-layer board; in a zero offset state, the first pads are not in conducted connection with thecorresponding left through hole and right through hole, a resistance meter is used for measuring the first pad of each inner-layer plate, and the left through hole or the right through hole, and the offset directions of the first pads are confirmed, and a maximum distance corresponding to the conduction of the first pads is recorded; and alignment data delta x of each inner-layer board are calculated. Compared with a micro-slicing method, the method has the advantages of high efficiency and no damage to the circuit board.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for detecting alignment between adjacent layers of a multilayer printed circuit board. Background technique [0002] With the continuous progress of the Internet, electronic information and signals are developing towards large capacity, diversification and rapid development. The amount of signal per wavelength has been developed from the original 10Gbps to 40Gbps, and even due to the development of multiplexing, it can reach Tbps signal capacity. The multi-layer printed circuit board design is more and more widely used, and the reliability and quality of the product are strictly required, especially the stability and integrity of the signal transmission are more stringent. The alignment between adjacent layers is one of the factors affecting signal transmission, and some high-end printed circuit boards have strict alignment requirements between adjac...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H05K3/46
CPCH05K3/4638
Inventor 张伟连
Owner ELEC & ELTEK GUANGZHOU ELECTRONICS