A detection method for alignment between adjacent layers of a multilayer printed circuit board
A technology of multi-layer printing and detection method, applied in the directions of printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of printed circuit board damage, time-consuming, unsuitable for batch alignment detection, etc.
Active Publication Date: 2022-07-15
ELEC & ELTEK GUANGZHOU ELECTRONICS
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Problems solved by technology
At present, the measurement method of micro-section is usually used to measure the alignment between adjacent layers, but this method takes a long time and is locally destructive to the printed circuit board, so it is not suitable for batch alignment detection
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[0025] This part will describe the specific embodiments of the present invention in detail, and the preferred embodiments of the present invention are shown in the accompanying drawings. Each technical feature and overall technical solution of the invention should not be construed as limiting the protection scope of the invention.
[0026] In the description of the present invention, it should be understood that the orientations related to the description, such as up, down, front, rear, left, right, etc., are based on the orientation or positional relationship shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it is not indicated or implied that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
[0027] refer to Figure 1-Figure 5 As shown, an embodimen...
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The invention discloses a detection method for alignment between adjacent layers of a multilayer printed circuit board, comprising the following steps: each inner layer board is provided with an x-direction detection module, the x-direction detection module is provided with a first Pad, and each inner layer is provided with an x-direction detection module. Each first Pad is provided with a first inner layer conductor; the inner layer board is pressed into a multi-layer printed circuit board; the multi-layer printed circuit board is provided with a left through hole and a right through hole, and the first Pad is correspondingly arranged between the left through hole and the Between the right through holes, along the direction from the back to the front, the distance between the first Pad and the left through hole gradually increases, the distance between the first Pad and the right through hole gradually decreases, and the first inner layer wire is connected to the outer layer board. ; In the zero-offset state, the first Pad and the corresponding left through hole and right through hole are not connected. Use a resistance meter to measure the first Pad and the left through hole or right through hole of each inner layer board to confirm the first Pad and the left through hole or the right through hole. Pad offset direction, and record the maximum pitch corresponding to the first Pad conduction; calculate the alignment data Δx of each inner layer board. Compared with the micro-slicing method, the invention has the characteristics of high efficiency and no damage to the circuit board.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for detecting alignment between adjacent layers of a multilayer printed circuit board. Background technique [0002] With the continuous progress of the Internet, electronic information and signals are developing towards large capacity, diversification and rapidity. The amount of signal per wavelength has been developed from the original 10Gbps to 40Gbps, and even due to the development of multiplexing, the signal capacity of Tbps can be reached. The design and application of multi-layer printed circuit boards are becoming more and more extensive, and the requirements for the reliability and quality of products are strict, especially for the stability and integrity of signal transmission. The alignment between adjacent layers is one of the factors affecting signal transmission. Some high-end printed circuit boards have strict alignment requirements b...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4638
Inventor 张伟连
Owner ELEC & ELTEK GUANGZHOU ELECTRONICS