MEMS microphone

Abstract

A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3)to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.

Description

Technical field [0001] The invention relates to the field of acoustic-electric conversion, in particular to a MEMS microphone. Background technique [0002] With the advancement of society and the development of electronic technology, electronic products occupy an increasingly important position in people’s daily lives. For example, mobile phones have almost become necessities that people need to carry with them. In electronic products such as mobile phones, To realize functions such as calls, a microphone needs to be set to collect sound signals. In order to meet the performance requirements of electronic products and the development trend of miniaturization, MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) microphones are usually used. The MEMS microphone is a package structure composed of a shell and a printed circuit board (PCB). A MEMS acoustic-electric chip is provided on the surface of the circuit board inside the package structure, and a MEMS acous...

AI Technical Summary

Problems solved by technology

Although the MEMS microphone is equipped with a protective part to prevent the impact of the external airflow on the MEMS acoustic-electric chip, but because the protective part is larger than the MEMS acoustic-electric chip, the package size of the MEMS microphone is limited, which is not conducive to miniaturization design.

In addition, the aperture of the communication hole of the protective member is smaller than the aperture of the acoustic hole, which has a large acoustic resistance, which leads to a serious decrease in the signal-to-noise ratio of the MEMS microphone and affects the acoustic performance of the MEMS microphone.

[0004] In addition, in the prior art MEMS microphones, there is a lack of anti-interference design for electromagnetic, radio frequency, light and suspended particles. Therefore, in the process of production and use, the above factors will cause interference to MEMS microphones, reducing the performance and stability

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