[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.
[0019] Examples of embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention, but should not be construed as limiting the present invention.
[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the pointed device or element It must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.
[0021] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more than two, unless specifically defined otherwise.
[0022] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection, or it can be an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0023] Reference Figure 1-4 As shown, the chip packaging clamping device includes a bottom plate 1, a clamping mechanism, and a fine adjustment mechanism. The clamping mechanism is fixedly installed on the bottom plate 1, and the clamping mechanism is used to fix and clamp the packaged chip board 14; the fine adjustment mechanism is used for The packaged chip board 14 after being clamped and fixed is fine-tuned and moved. In this embodiment, the packaged chip board 14 is clamped and fixed by a clamping mechanism. When the packaged chip board 14 needs to be fine-tuned and moved, both sides of the clamping mechanism The fine adjustment mechanism of the encapsulated chip board 14 is slightly moved to adapt to different process processing;
[0024] As a further improvement of the present invention, the clamping mechanism in this embodiment includes a positioning protrusion 2 and a transmission assembly. The upper two sides of the positioning protrusion 2 are provided with a supporting protrusion 9 respectively, and the insides of the two supporting protrusions 9 are respectively A first clamping rod 8 and a second clamping rod 13 are slidably connected. The first clamping rod 8 and the second clamping rod 13 are both L-shaped structures, and the transmission assembly is arranged between the positioning protrusion 2 and the bottom plate 1. And the transmission assembly acts on the first clamping rod 8 and the second clamping rod 13 to slide in the supporting protrusion 9 to clamp the packaged chip board 14. The transmission assembly acts to drive the first clamping rod 8 under the action of the driving system. Move relative to the second clamping rod 13 to realize the clamping operation of the packaged chip board 14;
[0025] Specifically, the transmission assembly in this embodiment includes a gear box 3, a gear 4 is rotatably installed inside the gear box 3, and a first rack box 5 and a second rack box 10 are connected to the upper and lower ends of the gear box 3, respectively. A first rack 6 and a second rack 11 are installed in the rack box 5 and the second rack box 10, respectively. The first rack 6 and the second rack 11 mesh with the gear 4, and the first rack 6 The left side extends out of the first rack box 5 and is fixedly connected to the first clamping rod 8 through the first connecting block 7, and the second rack 11 extends right out of the second rack box 10 and passes through the second connecting block 12 It is fixedly connected with the second clamping rod 13, and when the transmission assembly moves, the gear 4 rotates clockwise, and the first rack 6 and the second rack 11 respectively mesh with the gear 4, wherein the first rack 6 drives the first clamping rod 8 moves to the right, and the second rack 11 drives the second clamping rod 13 to move to the left. The first clamping rod 8 and the second clamping rod 13 cooperate to clamp the packaged chip board 14, and the chip to be packaged After the processing of the board 14 is completed, the gear 4 rotates counterclockwise, and the first clamping rod 8 and the second clamping rod 13 move in opposite directions to loosen the packaged chip board 14;
[0026] In order to improve the functionality of the clamping mechanism, the fine adjustment mechanism in this embodiment includes two cavity-shaped fine adjustment plates 15 respectively sleeved on the first clamping rod 8 and the second clamping rod 13 close to the packaged chip. The end of the plate 14 on one side, and the fine-tuning plate 15 is slidingly connected with the first clamping rod 8. The fine-tuning plate 15 is provided with a threaded hole. The threaded hole is threaded with a tightening bolt 17, and the tightening bolt 17 penetrates the fine-tuning The board 15 is set. The clamping end of the trimming board 15 has the same shape as the packaged chip board 14. When the packaged chip board 14 needs to be finely adjusted, loosen the tightening bolts 17, and the two trimming boards 15 cooperate to slide for adjustment. After the adjustment is completed Tighten the tightening bolt 17 again. The shape of the clamping end of the trimming plate 15 and the shape of the side end of the package chip board 14 are set to correspond to the structure, and the package chip board 14 can be directly clamped firmly, avoiding traditional needs The trouble of simultaneous fixing in the three directions of the side and the upper part makes the structure of the clamping mechanism simpler;
[0027] In this embodiment, the clamping end of the fine-tuning plate 15 is provided with a soft pad 16. Since the chip is small and easily broken, the provided soft pad 16 plays a protective role to prevent a clamping rod 8 and a second clamping rod 13 from directly contacting The packaged chip board 14 contacts and crushes it.
[0028] In this embodiment, the chip packaging clamping device further includes a driving system, which is used to drive the clamping mechanism to move; specifically, the driving system includes a motor, a controller, and an infrared transceiver system, and the motor is installed on one side of the gear box 3. And the output shaft of the motor is fixedly connected to the gear 4, and the output end of the controller is connected to the input end of the motor for electrical signals. The infrared transceiver system is composed of an infrared transmitter and an infrared receiver, and the infrared transmitter and the infrared receiver are respectively installed on the two Support the inner bottom of the bump 9, and the infrared transmitter and the infrared receiver are arranged oppositely, the output end of the infrared receiver is electrically connected with the input end of the controller, and the packaged chip board 14 is placed on the positioning bump 2 during operation, Since the packaged chip board 14 blocks the infrared rays emitted by the infrared transmitter, the infrared receiver cannot receive the infrared. The output end of the infrared receiver sends an electrical signal to the controller, and the controller controls the motor to rotate clockwise to drive the gear 4 to rotate clockwise. , The first clamping rod 8 and the second clamping rod 13 clamp the packaged chip board 14. When the packaged chip board 14 is processed, take it out, the infrared receiver receives the infrared rays emitted by the infrared transmitter, and the infrared receiver outputs electricity. The signal is sent to the controller, and the controller controls the reverse rotation of the motor to drive the gear 4 to rotate counterclockwise. The first clamping rod 8 and the second clamping rod 13 are separated from the package chip board 14 to loosen them, and the next package chip board 14 to be processed Place it on the positioning bump 2 and repeat the above steps to achieve continuous processing of the packaged chip board 14.
[0029] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone familiar with the technical field within the technical scope disclosed in the present invention, according to the technical solutions of the present invention and its Equivalent replacements or changes to the inventive concept should all fall within the protection scope of the present invention.
