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Chip package clamping device

A clamping device and chip packaging technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as low production efficiency, unsuitable semiconductor packaging automation process, misalignment, etc., to improve processing efficiency and save clamping Fixed time, simple structure effects

Inactive Publication Date: 2019-12-17
合肥合晶电子有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the chip is small in size and easy to break. If it is moved and clamped again by the clamping mechanism, it will be more troublesome, often causing misalignment, and also causing low production efficiency. It is not suitable for the automation process of semiconductor packaging. A device that can automatically position and hold chips

Method used

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  • Chip package clamping device
  • Chip package clamping device
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Embodiment Construction

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0019] Examples of embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention, but should not be construed as limiting the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal"...

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Abstract

The invention discloses a chip package clamping device, which comprises a bottom plate, a clamping mechanism and a fine adjustment mechanism. The clamping mechanism is fixedly arranged on the bottom plate and is used for fixedly clamping a package chip plate; and the fine adjustment mechanism is used for carrying out fine adjustment movement on the clamped and fixed package chip plate. The clamping mechanism adopts a gear and rack transmission structure; during clamping operation, opposite movement of two clamping rods can be realized by rotating one gear, so that the package chip plate is firmly clamped; a plurality of different processes exist in the processing process of the package chip plate; and when the package chip plate needs to be slightly moved and finely adjusted, by loosing and tightening bolts, two fine adjustment plates move in a cooperated manner to realize fine adjustment of the package chip plate, thereby preventing repeated operation of the clamping mechanism, savingclamping and fixing time of the package chip plate and effectively improving the processing efficiency of the package chip plate.

Description

Technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging clamping device. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge between the internal world of the chip and the external circuit-the contacts on the chip are connected to the package shell with wires On the pins, these pins are connected to other devices through wires on the printed board; in semiconductor packaging, the chip needs to be moved for various processes, such as die bonding. However, the chip is small and easily broken. If it is moved and clamped again by the clamping mechanism, it is more troublesome and often causes misalignment. At the same time, it also causes low production efficiency and is not suitable for the automated process of semiconductor packaging. Therefore,...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67121H01L21/683
Inventor 芮平平
Owner 合肥合晶电子有限责任公司
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