Read-write equalization method and device based on three-dimensional flash memory and computer device

Abstract

The invention relates to a read-write equalization method and device based on a three-dimensional flash memory, a computer device and a storage medium. The method comprises the steps of obtaining a read-write equalization request based on the three-dimensional flash memory; according to the request, dividing a spatial physical block corresponding to the three-dimensional flash memory into a plurality of block bands through a spatial discrete division algorithm, wherein all blocks in the same block band are not adjacent in three spatial directions; and when a new block needs to be allocated tothe logic block, discretely selecting on the spatial physical block to disperse the continuous logic access to the whole physical space. According to the present invention, the physical block is divided into the plurality of block bands, and the frequently accessed data is dispersed in space according to the updating frequency of the data, so that the heat accumulation is favorably relieved, and the problem of high temperature in the three-dimensional flash memory is solved.

Description

technical field [0001] The invention relates to the technical field of computer storage, in particular to a method, device, computer equipment and storage medium for reading and writing equalization based on three-dimensional flash memory. Background technique [0002] At present, 3D flash memory provides much larger capacity than 2D flash memory through stacking technology, and provides better programming and erasing performance. Similarly, due to the increase in storage density of 3D flash memory, the capacity of a single page and block greatly exceeds that of 2D flash memory. Flash memory, which makes reading and writing more concentrated, and the heat changes caused by erasing operations are greater. In some application scenarios, the temperature of the three-dimensional flash memory chip is much higher than that of the two-dimensional chip, and in the high-temperature environment of the storage unit, the oxide layer will accelerate the wear and tear, and the charge will...

AI Technical Summary

Problems solved by technology

However, the first allocation strategy increases the cost of data management; the second strategy relies on temperature sensors, and the process of finding the lowest temperature is relatively expensive

Images