Composite cooling fin, preparation method thereof and electronic equipment terminal

Abstract

The invention discloses a composite cooling fin which comprises a first base layer, a second base layer and a third base layer which are sequentially arranged in a stacked mode., the The first base layer is nano metal foil, and patterned grooves are formed in the first base layer; the second base layer is a phase-change heat storage functional layer and is formed by filling the patterned groove with phase-change heat storage slurry and curing; the third base layer is a heat radiation layer and is formed by coating heat radiation slurry on the phase change heat storage functional layer and curing; the main body material of the phase change heat storage slurry is phase change microcapsules and matrix resin or a shape memory polyurethane material, and the main body material of the heat radiation slurry is one or two of graphite and graphene. The invention further discloses a preparation method of the composite cooling fin and an electronic equipment terminal comprising the composite cooling fin. According to the composite cooling fin, the 3D cooling effect of the composite cooling fin is improved through the characteristics of conduction, heat storage, radiation and the like of the organic composite material.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials, in particular to a composite heat sink, its preparation method and an electronic device terminal containing the composite heat sink. Background technique [0002] With the advent of the 5G era, all kinds of electronic smart product terminals are constantly being updated. The thinner, smarter, and more multi-functional electronic devices make the power consumption of electronic devices higher and higher, and the heat is also increasing. Heat dissipation is becoming an urgent problem to be improved and solved for 5G smart terminal equipment. At present, in electronic equipment terminals, commonly used heat conduction / heat dissipation materials are mainly graphite sheets and thermal interface materials such as heat conduction gels, heat conduction sheets, etc., and metal-based heat sinks. However, most thermal interface materials can only be filled between the heat source and the...

AI Technical Summary

Problems solved by technology

However, most thermal interface materials can only be filled between the heat source and the heat sink, and only have the effect of conduction and heat dissipation

At the same time, graphite sheets and metal-based heat sinks can only rely on their own high thermal conductivity to conduct heat to achieve the effect of heat dissipation and cooling; while for electronic equipment in narrow enclosed spaces, or terminals without auxiliary heat dissipation equipment such as radiators, Efficient heat dissipation and cooling is still a technical difficulty at present

[0003] In the prior art, although the heat conduction sheet with graphite sheet as the main body has a high thermal conductivity in the plane, its brittle and brittle defects make it easy to cause problems and cause contamination of electronic equipment; in addition, thermal interface materials such as thermal gel Although products such as heat-conducting glue can fill the gap between the heat source and the heat sink for good heat conduction, they can only play the role of heat conduction and heat dissipation to the greatest extent when they are used in conjunction with auxiliary heat dissipation equipment such as heat sinks; therefore, The above heat conduction and heat dissipation materials all use the conduction or heat radiation characteristics of the material itself to achieve the effect of heat conduction and heat dissipation.

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