Step-by-step glue filling device and glue filling method for capacitor preparation
A capacitor and glue filling technology, which is applied in the packaging of capacitor devices, capacitor manufacturing, capacitors, etc., can solve the problems of more contact with the filling glue, insufficient vacuum degree of the capacitor, and affecting the protective effect of the glue, so as to avoid gas entry and reduce contact. Surface, improve the effect of potting effect
Active Publication Date: 2021-08-03
HUANGSHAN SHENGE ELECTRONICS TECH
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Problems solved by technology
[0003] In the current glue filling operation, the existence of bubbles in the colloid is the biggest problem. The existence of bubbles in the colloid will affect the protective effect of the colloid, and the strength and insulation will decrease. There are two main reasons for the bubbles. On the one hand, the raw materials carry On the other hand, during the filling process, the vacuum in the capacitor is not enough, and the filling glue is exposed to more air, and part of the gas will be brought into the glue.
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[0035] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0036] The step-by-step glue filling device for capacitor preparation includes a driving mechanism 1; a charging head 2 and a vacuum pump 3 are installed inside the driving mechanism 1, and the outlet of the charging head 2 is connected to a hard feeding pipe 21, and the vacuum pump 3 The inlet is connected to a hard air extraction pipe 31, and the bottom ends of the feeding pipe 21 and the air extraction pipe 31 are fixedly connected to the flow guiding mechanism 4. The hard pipes used for the feeding pipe 21 and the air extraction pipe 31 are due to the fact that the feeding pipe 21, the air extraction pipe On the one han...
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A step-by-step glue filling device and glue filling method for capacitor preparation, including a driving mechanism; a feeding head and a vacuum pump are installed inside the driving mechanism, the outlet of the feeding head is connected to a hard feeding pipe, and the outlet of the vacuum pump is connected to Hard air extraction pipe, the bottom ends of the feeding pipe and the air extraction pipe are fixedly connected to the flow guide mechanism, the center of the flow guide mechanism is a through hole, and the through hole seamlessly slides and fits on the core body The outer wall, the core body is set at the center of the shell; the molten material of the present invention flows down along the inner wall of the shell, on the one hand, it can slow down the flow speed of the pouring glue, reduce the impact between the colloids, so that the colloids can cover evenly On the other hand, the entire room to be filled can minimize the contact surface between the potting glue and the air, avoiding the entry of gas, and at the same time, it will not block the flow path of the gas to ensure the normal discharge of the gas.
Description
technical field [0001] The invention belongs to the technical field of metallized film capacitors, in particular to a step-by-step glue filling device for capacitor preparation and a glue filling method thereof. Background technique [0002] During the production of capacitors, glue needs to be poured between the core and the shell to achieve the effects of sealing, waterproofing and insulation. The glue A is the main agent in the glue, and glue B is the curing agent. It is the most widely used glue on the market. For epoxy resin; [0003] In the current glue filling operation, the existence of bubbles in the colloid is the biggest problem. The existence of bubbles in the colloid will affect the protective effect of the colloid, and the strength and insulation will decrease. There are two main reasons for the bubbles. On the one hand, the raw materials carry On the other hand, during the filling process, the vacuum in the capacitor is not enough, and the filling glue is exp...
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IPC IPC(8): H01G13/00
CPCH01G13/003
Inventor 张宏远
Owner HUANGSHAN SHENGE ELECTRONICS TECH