Sorting taping machine for semiconductor chips

Abstract

The invention relates to the field of semiconductor processing equipment, in particular to a sorting taping machine for semiconductor chips. The sorting taping machine comprises a control assembly, adetection sorting assembly, a feeding assembly and a taping assembly. The feeding assembly comprises a static electricity removing device, a dredging device, a feeding guide rail and a vibration disc.A first air inlet and a second air inlet are formed in an inlet of the feeding guide rail, and an extraction opening is formed in an outlet of the feeding guide rail; the static electricity removingdevice comprises an ion fan and an extraction dust removing mechanism, and the dredging device comprises an air blowing mechanism and an impactor. According to the sorting taping machine, static electricity and dust removal effects can be achieved on semiconductor chips in the feeding guide rail, and dust accumulation in the feeding guide rail and blockage of the semiconductor chips are prevented;while a larger pushing force can be provided for the semiconductor chips, the blockage caused by mutual extrusion of the semiconductor chips in the feeding guide rail can be damaged, and a dredging effect is achieved.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to a sorting and braiding machine for semiconductor chips. Background technique [0002] After the semiconductor chip is manufactured, it needs to be inspected, marked, sorted and taped and packaged. The existing sorting and braiding machine includes a detection and sorting assembly, a feeding assembly for transferring semiconductor chips to the detection and sorting assembly, and a tape assembly for packaging qualified semiconductor chips. The semiconductor chips are arranged according to the set direction and transferred to the loading guide rail, and the force of the vibrating plate is used to push the semiconductor chips to move on the feeding guide rail. [0003] The semiconductor chip is easy to mix and generate dust during the vibration process. These dusts will hinder the movement of the semiconductor chip on the feeding guide rail, causing the semiconducto...

AI Technical Summary

Problems solved by technology

[0003] The semiconductor chip is easy to mix and generate dust during the vibration process. These dusts will hinder the movement of the semiconductor chip on the feeding guide rail, causing the semiconductor chip to be blocked in the feeding guide rail. The dust port sucks the dust in the loading guide rail, but the suction of the dust suction port will affect the movement of the semiconductor chip, and the anti-blocking effect is not obvious

Moreover, when the semiconductor chip advances in the feeding guide rail under the vibration of the vibrating plate, static electricity will be generated. These static electricity will not only affect the quality of the semiconductor chip, but also affect the movement of the semiconductor chip in the feeding guide rail.

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