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A kind of preparation method of graphene ceramic circuit substrate

A circuit substrate, graphene technology, applied in vacuum evaporation plating, coating, sputtering plating and other directions, to achieve the effect of solving the yield

Active Publication Date: 2021-09-21
江苏泰芯源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a method for preparing a graphene ceramic circuit substrate in view of the deficiencies in the above-mentioned prior art, which solves the complicated process of conventionally preparing graphene and has a high yield

Method used

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  • A kind of preparation method of graphene ceramic circuit substrate

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preparation example Construction

[0037] A kind of preparation method of graphene ceramic circuit board of the present invention comprises the following steps:

[0038] S1, (alumina, aluminum nitride, zirconia, etc.) before substrate 1 is sprayed, the substrate is first degreased and dried with 40g / L acetone degreaser; Clean with weak acid salt, decontaminate and activate the surface, the temperature is 19-30°C, and the time is 20-50Sec;

[0039] S2. Polish the cleaned substrate on a grinder until the plane finish is Ra<0.008um. After the polishing is completed, use the S1 method to clean it. After cleaning, dry it in an oven at 100-120°C for 10-30 minutes;

[0040] S3. Place the polished substrate in the coating chamber, turn on the vacuum pump to evacuate to 0.1-0.01pa, heat the polished substrate to 550-650°C and perform ion bombardment. The ion bombardment voltage is 200V-1kV negative high voltage, and the time is 10-40min. Then adjust The current is 30-60A to pre-melt the nickel plating material and dega...

Embodiment 1

[0045] A kind of preparation method of graphene ceramic circuit board of the present invention comprises the following steps:

[0046]S1. Before spraying the substrate, first degrease and dry it with 40g / L acetone degreasing agent; then wash it with water at a temperature of 30°C for 1min, and clean it with a weak acid salt to decontaminate and activate the surface at a temperature of 19°C and a time of 20Sec;

[0047] S2. Polish the cleaned substrate on a grinder until the plane finish is Ra<0.008um. After the polishing is completed, use the S1 method to clean it. After cleaning, dry it in an oven at 100°C for 10 minutes;

[0048] S3. Place the polished substrate in the coating chamber, turn on the vacuum pump to evacuate to 0.1pa, heat the polished substrate to 550°C and perform ion bombardment. The ion bombardment voltage is 200V negative high voltage, and the time is 10min. Melt and degas for 1 min. After the pre-melting is completed, adjust the current to 70A for evapora...

Embodiment 2

[0052] A kind of preparation method of graphene ceramic circuit board of the present invention comprises the following steps:

[0053] S1. Before spraying the substrate, first degrease and dry it with 40g / L acetone degreasing agent; then wash it with water at a temperature of 40°C for 4 minutes, clean it with a weak acid salt, decontaminate and activate the surface, the temperature is 22°C, and the time is 30Sec;

[0054] S2. Polish the cleaned substrate on a grinder until the plane finish is Ra<0.008um. After the polishing is completed, use the S1 method to clean it. After cleaning, dry it in an oven at 105°C for 15 minutes;

[0055] S3. Place the polished substrate in the coating chamber, turn on the vacuum pump to evacuate to 0.04pa, heat the polished substrate to 570°C and perform ion bombardment. The ion bombardment voltage is 400V negative high voltage, and the time is 20min. Melt and degas for 1.5min. After the pre-melting is completed, adjust the current to 80A for ev...

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Abstract

The invention discloses a preparation method of a graphene superconducting ceramic circuit substrate. The substrate is washed with water, and then cleaned by a weak acid salt; polished, cleaned, and dried; placed in a coating chamber and vacuumized, and the polished The treated substrate is heated for ion bombardment, and then the nickel plating material is pre-melted. After the pre-melting is completed, it is evaporated and deposited, and the first stirring and ultrasonic cleaning are performed to obtain a graphene dispersion; The emulsion is added to the graphene dispersion, and the base material is obtained after the second stirring; the attapulgite, sodium polyacrylate, defoamer and film-forming agent are added to the base material in turn, and the obtained mixed solution is stirred for the third time Graphene paint is made; the graphene paint is loaded into a spray gun, sprayed evenly on the surface of the substrate, dried after spraying, and sintered to obtain a graphene superconducting ceramic circuit substrate. The preparation process of the method is simple and convenient, and the prepared graphene coating has strong binding force and smooth surface.

Description

technical field [0001] The invention belongs to the technical field of surface modification of metal composite materials, and in particular relates to a preparation method of a graphene ceramic circuit substrate. Background technique [0002] With the rapid development of science and technology, general metal coatings can no longer meet the needs of the modern electronics industry. Graphene coatings not only have ultra-high electrical conductivity, but also use ceramic materials (alumina, aluminum nitride, zirconia) as The carrier can effectively improve the mechanical properties of the substrate, obtain high temperature stability, high strength and stiffness, superior thermal conductivity and electrical conductivity. Excellent performance and intrinsic physical and chemical properties are integrated to improve the comprehensive performance of the conductive substrate. At present, due to the complex preparation process of graphene coatings and low yield, and the poor combin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D133/04C09D7/61C09D7/65C23C14/24C23C14/18C23C14/02
CPCC09D143/04C23C14/022C23C14/18C23C14/24C09D7/61C09D7/65C08L33/02C08K13/02C08K3/042C08K3/34C08K3/346
Inventor 黄剑孔婷婷汪力张倩苏碧云王文珍
Owner 江苏泰芯源科技有限公司
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