A kind of evaporation method of revolution type semiconductor evaporation table

Abstract

The invention discloses an evaporation method for a revolving semiconductor evaporation table. S1. Preliminary preparation of the equipment: S11, providing a revolving evaporation table; S12, starting a vacuuming device to evacuate the evaporation chamber; S2, taking a material arm Deflection removes a slide cover from the rotating ring; S3, the reclaiming arm is deflected by 90° to move the slide cover to the evaporation station; S4, the slide cover on the evaporation station rotates; S5, electron beam generation The device is started to generate a high-energy electron beam, and the metal in the crucible is heated to evaporate it; S6. After the evaporation of the slide cover is completed, the reclaiming arm swings 90° in the opposite direction, and the evaporated slide cover is placed on the rotating ring; S7 . Rotate the rotating ring to rotate the other slide cover to the cap removal station; S8, repeat steps S2 to S6 until all the slide covers on the rotating ring are evaporated. The evaporation method can complete the evaporation on a plurality of slide covers in one batch, which improves the evaporation efficiency, ensures the evaporation precision, and reduces the vacuuming time.

Description

technical field [0001] The invention relates to an evaporation method using a revolution type semiconductor evaporation table, and belongs to the technical field of semiconductors. Background technique [0002] Evaporation table is a commonly used semiconductor equipment. Its main structure includes a lower casing and an upper cover. The inner space between the lower casing and the upper cover forms an evaporation chamber. The bottom of the evaporation chamber is provided with a crucible for placing metal. The bottom of the evaporation chamber is provided with an electron beam generating device and a vacuuming device for evacuating the evaporation chamber. A carrier cover is arranged in the evaporation chamber. The carrier cover is used to place semiconductor wafers. The evaporation method is as follows: first, vacuumize the evaporation chamber to maintain a certain vacuum, and place the metal in the crucible. Then, the electron beam generator generates a high-energy electro...

AI Technical Summary

Problems solved by technology

According to the placement form of the slide cover, the current evaporation methods include planetary evaporation method (Planetary) and revolution evaporation method. In the planetary evaporation method, several slide covers are placed obliquely around the evaporation chamber and rotated by the rotating ring. , the planetary evaporation table can evaporate multiple slide covers at one time, and multiple wafers are fixed on each slide cover, so more wafers can be evaporated at one time, but the evaporation accuracy of this evaporation table is not good. High, because the slide cover is in a tilted state during evaporation, so the distance between the wafer on the slide cover and the crucible is not equal, so the metal film obtained by evaporation is not uniform

In the current revolution evaporation method, a carrier cover driven by a rotating motor is placed directly above the crucible. During evaporation, the carrier cover is directly above the crucible, and the distance between the wafer on the carrier cover and the crucible is equal. When the metal gas rises, it will adhere to the wafer of the slide cover. Compared with the planetary evaporation method, the precision of this evaporation method is higher, but it needs to open the cover frequently to replace the wafer, and then frequently vacuumize. The time of evaporation is longer than the evaporation time, so the efficiency of this revolution evaporation method is very low

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