Semiconductor film and preparation method thereof
A technology for semiconductors and thin films, applied in the field of semiconductor thin films and their preparation, can solve the problems of characteristic decline, the influence of the use of semiconductor thin films, etc., and achieve the effects of improving performance and increasing ion content
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Embodiment 1
[0022] An embodiment of the present invention provides a semiconductor thin film, which is composed of niobium pentoxide, titanium diboride and chromium oxide, wherein the molar ratio of niobium pentoxide, titanium diboride and chromium oxide is 0.3:0.3:0.4, and the thin film The thickness is 30-40nm.
[0023] SiH by introducing dopant gas 4 、SiF 4 with SiH 2 Ci 4 , so that the semiconductor film contains a small amount of H ions, so that a layer of network structure is formed on the surface of the semiconductor film, so that the characteristics of the semiconductor film will not decline after being irradiated by strong light, and the normal use of the semiconductor film is guaranteed.
[0024] A method for preparing a semiconductor thin film, comprising the steps of:
[0025] S1. Prepare niobium pentoxide, titanium diboride and chromium oxide, mix niobium pentoxide, titanium diboride and chromium oxide evenly, calcinate them, and then granulate, press and sinter in sequen...
Embodiment 2
[0031] An embodiment of the present invention provides a semiconductor thin film, which is composed of niobium pentoxide, titanium diboride and chromium oxide, wherein the molar ratio of niobium pentoxide, titanium diboride and chromium oxide is 0.3:0.3:0.4, and the thin film The thickness is 30-40nm.
[0032] A method for preparing a semiconductor thin film, comprising the steps of:
[0033] S1. Prepare niobium pentoxide, titanium diboride and chromium oxide, mix niobium pentoxide, titanium diboride and chromium oxide evenly, calcinate them, and then granulate, press and sinter in sequence to obtain ceramics target;
[0034] S2. Select a substrate and pretreat it, then send the target and the substrate into the vacuum device, and at the same time feed the rare gas into the vacuum device. When the fed rare gas reaches the preset value, Stop the introduction of rare gas, and form a semiconductor thin film on the substrate by using the glow discharge method;
[0035] S3. Feed...
Embodiment 3
[0038] An embodiment of the present invention provides a semiconductor thin film, which is composed of niobium pentoxide, titanium diboride and chromium oxide, wherein the molar ratio of niobium pentoxide, titanium diboride and chromium oxide is 0.3:0.3:0.4, and the thin film The thickness is 30-40nm.
[0039] A method for preparing a semiconductor thin film, comprising the steps of:
[0040] S1. Prepare niobium pentoxide, titanium diboride and chromium oxide, mix niobium pentoxide, titanium diboride and chromium oxide evenly, calcinate them, and then granulate, press and sinter in sequence to obtain ceramics target;
[0041] S2. Select a substrate and pretreat it, then send the target and the substrate into the vacuum device, and at the same time feed the rare gas into the vacuum device. When the fed rare gas reaches the preset value, Stop the introduction of rare gas, and form a semiconductor thin film on the substrate by using the glow discharge method;
[0042] S3. Feed d...
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Abstract
Description
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